Hsien‐Chie Cheng

94 papers and 1.3k indexed citations i.

Hsien‐Chie Cheng has authored 94 papers that have received a total of 1.3k indexed citations. This includes 57 papers in Electrical and Electronic Engineering, 28 papers in Materials Chemistry and 25 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (30 papers) and Boron and Carbon Nanomaterials Research (17 papers). Hsien‐Chie Cheng is often cited by papers focused on Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (30 papers) and Boron and Carbon Nanomaterials Research (17 papers) and collaborates with scholars based in Taiwan, United States and Belgium. Hsien‐Chie Cheng's co-authors include Wen‐Hwa Chen, Kuo‐Ning Chiang, Su-Tsai Lu, Chun‐Hung Wu and Yu‐Chen Hsu and has published in prestigious journals such as Journal of Computational Physics, Computer Methods in Applied Mechanics and Engineering and Journal of Materials Science.