Hsien‐Chie Cheng
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 5%
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 59
- 3D IC and TSV technologies 38
- Silicon Carbide Semiconductor Technologies 16
- Electromagnetic Compatibility and Noise Suppression 8
- Co-authors
- Wen‐Hwa Chen (56 shared papers)Kuo‐Ning Chiang (15 shared papers)Su‐Tsai Lu (10 shared papers)Noboru Kikuchi (2 shared papers)Yu‐Chen Hsu (4 shared papers)Chun‐Hung Wu (6 shared papers)Po-Wen Hwang (3 shared papers)Cheng Peng (1 shared paper)
- Journals
- IEEE Transactions on Components and Packaging Technologies (7 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (6 papers)IEEE Transactions on Device and Materials Reliability (5 papers)Computational Materials Science (5 papers)Journal of Electronic Packaging (5 papers)
- Partner nations
- TaiwanUnited StatesBelgium
In The Last Decade
Hsien‐Chie Cheng
115 papers receiving 1.6k citations
Peers
Comparison fields: 5 of 76
- Electrical and Electronic Engineering 934
- Mechanical Engineering 498
- Mechanics of Materials 321
- Materials Chemistry 479
- Automotive Engineering 90
Countries citing papers authored by Hsien‐Chie Cheng
This map shows the geographic impact of Hsien‐Chie Cheng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hsien‐Chie Cheng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hsien‐Chie Cheng more than expected).
Fields of papers citing papers by Hsien‐Chie Cheng
This network shows the impact of papers produced by Hsien‐Chie Cheng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hsien‐Chie Cheng. The network helps show where Hsien‐Chie Cheng may publish in the future.
Co-authors
The 25 scholars most cited alongside Hsien‐Chie Cheng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 122 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1994 | 74 | |
| 2 | 2012 | 70 | |
| 3 | 2008 | 64 | |
| 4 | 2004 | 64 | |
| 5 | 2012 | 58 | |
| 6 | 2009 | 55 | |
| 7 | 2003 | 52 | |
| 8 | 2011 | 50 | |
| 9 | 2010 | 47 | |
| 10 | 2009 | 38 | |
| 11 | 2000 | 37 | |
| 12 | 2007 | 33 | |
| 13 | 2020 | 31 | |
| 14 | 2019 | 29 | |
| 15 | 2016 | 28 | |
| 16 | 2004 | 28 | |
| 17 | 2010 | 27 | |
| 18 | 2010 | 26 | |
| 19 | 2005 | 26 | |
| 20 | 2004 | 26 |
About Hsien‐Chie Cheng
Hsien‐Chie Cheng is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Materials Chemistry and Civil and Structural Engineering, having authored 122 papers that have together received 1.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (59 papers), 3D IC and TSV technologies (38 papers), Boron and Carbon Nanomaterials Research (17 papers), Silicon Carbide Semiconductor Technologies (16 papers), Metal and Thin Film Mechanics (10 papers), Adhesion, Friction, and Surface Interactions (9 papers), Carbon Nanotubes in Composites (9 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (934 citations), Mechanical Engineering (498 citations), Mechanics of Materials (321 citations), Materials Chemistry (479 citations) and Automotive Engineering (90 citations). Hsien‐Chie Cheng has collaborated with scholars based in Taiwan, United States and Belgium. Frequent co-authors include Wen‐Hwa Chen, Kuo‐Ning Chiang, Su‐Tsai Lu, Noboru Kikuchi, Yu‐Chen Hsu, Chun‐Hung Wu, Po-Wen Hwang, Cheng Peng, Kun-Nan Chen and Jiayun Lin. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, Computational Materials Science and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.