Hsien‐Chie Cheng
Impact in
- Mechanics of Materials top 1%
- Composite Structure Analysis and Optimization
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- Topology Optimization in Engineering
Papers in
-
- Electronic Packaging and Soldering Technologies 59
- 3D IC and TSV technologies 38
- Silicon Carbide Semiconductor Technologies 16
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- Metal and Thin Film Mechanics 10
- Adhesion, Friction, and Surface Interactions 9
- Co-authors
- Wen‐Hwa Chen (57 shared papers)Noboru Kikuchi (7 shared papers)Zheng-Dong Ma (3 shared papers)Kuo‐Ning Chiang (15 shared papers)Su‐Tsai Lu (10 shared papers)Yu‐Chen Hsu (4 shared papers)Ichiro Hagiwara (3 shared papers)Chun‐Hung Wu (6 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (7 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (6 papers)IEEE Transactions on Device and Materials Reliability (5 papers)Journal of Electronic Packaging (5 papers)Microelectronics Reliability (5 papers)
- Partner nations
- TaiwanUnited StatesJapan
In The Last Decade
Hsien‐Chie Cheng
120 papers receiving 2.3k citations
Hsien‐Chie Cheng's Hit Papers
Peers
Comparison fields: 5 of 83
- Mechanics of Materials 768
- Civil and Structural Engineering 675
- Electrical and Electronic Engineering 980
- Computational Theory and Mathematics 278
- Mechanical Engineering 546
Countries citing papers authored by Hsien‐Chie Cheng
This map shows the geographic impact of Hsien‐Chie Cheng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hsien‐Chie Cheng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hsien‐Chie Cheng more than expected).
Fields of papers citing papers by Hsien‐Chie Cheng
This network shows the impact of papers produced by Hsien‐Chie Cheng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hsien‐Chie Cheng. The network helps show where Hsien‐Chie Cheng may publish in the future.
Co-authors
The 25 scholars most cited alongside Hsien‐Chie Cheng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 127 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Topological design for vibrating structures Hit paper breakdown → | 1995 | 381 |
| 2 | 1994 | 95 | |
| 3 | 1994 | 78 | |
| 4 | 2012 | 72 | |
| 5 | 2008 | 71 | |
| 6 | 1995 | 70 | |
| 7 | 2004 | 65 | |
| 8 | 2012 | 64 | |
| 9 | 2009 | 56 | |
| 10 | 2003 | 52 | |
| 11 | 2011 | 50 | |
| 12 | 2010 | 50 | |
| 13 | 2009 | 40 | |
| 14 | 2000 | 38 | |
| 15 | 2020 | 33 | |
| 16 | 2007 | 33 | |
| 17 | 2019 | 29 | |
| 18 | 2004 | 29 | |
| 19 | 2016 | 28 | |
| 20 | 2004 | 28 |
About Hsien‐Chie Cheng
Hsien‐Chie Cheng is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Materials Chemistry and Civil and Structural Engineering, having authored 127 papers that have together received 2.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (59 papers), 3D IC and TSV technologies (38 papers), Boron and Carbon Nanomaterials Research (17 papers), Silicon Carbide Semiconductor Technologies (16 papers), Carbon Nanotubes in Composites (10 papers), Topology Optimization in Engineering (10 papers), Metal and Thin Film Mechanics (10 papers) and Adhesion, Friction, and Surface Interactions (9 papers). The work is most often cited by research in Mechanics of Materials (768 citations), Civil and Structural Engineering (675 citations), Electrical and Electronic Engineering (980 citations), Computational Theory and Mathematics (278 citations) and Mechanical Engineering (546 citations). Hsien‐Chie Cheng has collaborated with scholars based in Taiwan, United States and Japan. Frequent co-authors include Wen‐Hwa Chen, Noboru Kikuchi, Zheng-Dong Ma, Kuo‐Ning Chiang, Su‐Tsai Lu, Yu‐Chen Hsu, Ichiro Hagiwara, Chun‐Hung Wu, Po-Wen Hwang and Cheng Peng. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, Journal of Electronic Packaging and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.