Chiapyng Lee
Impact in
- Surfaces, Coatings and Films top 5%
- Polymer Surface Interaction Studies
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- Copper Interconnects and Reliability
Papers in
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- Semiconductor materials and devices 28
- Electronic Packaging and Soldering Technologies 21
- 3D IC and TSV technologies 7
- Silicon Carbide Semiconductor Technologies 6
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- Copper Interconnects and Reliability 27
- Co-authors
- Yee‐Wen Yen (21 shared papers)Yu‐Lin Kuo (17 shared papers)Jing‐Cheng Lin (13 shared papers)Chung‐Yung Lin (7 shared papers)Meng‐Jiy Wang (5 shared papers)Wei‐Hsuan Kuo (3 shared papers)Wei‐Bor Tsai (3 shared papers)Ta‐Chin Wei (2 shared papers)
- Journals
- Journal of The Electrochemical Society (9 papers)Materials Chemistry and Physics (7 papers)Journal of Alloys and Compounds (5 papers)Applied Surface Science (5 papers)Electrochemical and Solid-State Letters (5 papers)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Chiapyng Lee
68 papers receiving 1.5k citations
Peers
Comparison fields: 5 of 75
- Surfaces, Coatings and Films 140
- Electronic, Optical and Magnetic Materials 359
- General Materials Science 56
- Electrical and Electronic Engineering 936
- Mechanics of Materials 341
Countries citing papers authored by Chiapyng Lee
This map shows the geographic impact of Chiapyng Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chiapyng Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chiapyng Lee more than expected).
Fields of papers citing papers by Chiapyng Lee
This network shows the impact of papers produced by Chiapyng Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chiapyng Lee. The network helps show where Chiapyng Lee may publish in the future.
Co-authors
The 25 scholars most cited alongside Chiapyng Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 70 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1995 | 150 | |
| 2 | 2011 | 132 | |
| 3 | 2001 | 62 | |
| 4 | 2009 | 58 | |
| 5 | 2007 | 57 | |
| 6 | 1999 | 53 | |
| 7 | 2010 | 47 | |
| 8 | 2003 | 46 | |
| 9 | 2007 | 39 | |
| 10 | 2007 | 39 | |
| 11 | 2007 | 36 | |
| 12 | 2012 | 36 | |
| 13 | 2006 | 35 | |
| 14 | 1998 | 34 | |
| 15 | 2004 | 33 | |
| 16 | 1995 | 32 | |
| 17 | 1999 | 30 | |
| 18 | 2006 | 29 | |
| 19 | 2004 | 26 | |
| 20 | 2008 | 26 |
About Chiapyng Lee
Chiapyng Lee is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Mechanics of Materials and Materials Chemistry, having authored 70 papers that have together received 1.5k indexed citations. Recurring topics across this work include Semiconductor materials and devices (28 papers), Copper Interconnects and Reliability (27 papers), Electronic Packaging and Soldering Technologies (21 papers), Metal and Thin Film Mechanics (16 papers), Intermetallics and Advanced Alloy Properties (14 papers), Advanced Welding Techniques Analysis (9 papers), 3D IC and TSV technologies (7 papers) and Silicon Carbide Semiconductor Technologies (6 papers). The work is most often cited by research in Surfaces, Coatings and Films (140 citations), Electronic, Optical and Magnetic Materials (359 citations), General Materials Science (56 citations), Electrical and Electronic Engineering (936 citations) and Mechanics of Materials (341 citations). Chiapyng Lee has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Yee‐Wen Yen, Yu‐Lin Kuo, Jing‐Cheng Lin, Chung‐Yung Lin, Meng‐Jiy Wang, Wei‐Hsuan Kuo, Wei‐Bor Tsai, Ta‐Chin Wei, Hsiu‐Wen Chien and Yong‐Siou Chen. Their work appears in journals such as Journal of The Electrochemical Society, Materials Chemistry and Physics, Journal of Alloys and Compounds, Applied Surface Science and Electrochemical and Solid-State Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.