Yang Zuo
Impact in
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
- High Entropy Alloys Studies
- Advanced materials and composites
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
Papers in
-
- High Entropy Alloys Studies 12
- Aluminum Alloys Composites Properties 5
- Structural Integrity and Reliability Analysis 4
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- Electronic Packaging and Soldering Technologies 10
- 3D IC and TSV technologies 5
- Co-authors
- S.H. Mannan (5 shared papers)Jun Shen (4 shared papers)Xiaoxiong Zha (5 shared papers)Runhua Gao (3 shared papers)Mark Green (2 shared papers)Huabei Peng (14 shared papers)Yuhua Wen (11 shared papers)Lu Xiang (1 shared paper)
- Journals
- Materials Science and Engineering A (3 papers)Materials Characterization (3 papers)Acta Materialia (3 papers)Journal of Alloys and Compounds (2 papers)Materials Letters (2 papers)
- Partner nations
- ChinaJapanUnited Kingdom
In The Last Decade
Yang Zuo
32 papers receiving 417 citations
Peers
Comparison fields: 5 of 38
- Mechanical Engineering 249
- Electrical and Electronic Engineering 214
- Electronic, Optical and Magnetic Materials 38
- Building and Construction 26
- Civil and Structural Engineering 41
Countries citing papers authored by Yang Zuo
This map shows the geographic impact of Yang Zuo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yang Zuo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yang Zuo more than expected).
Fields of papers citing papers by Yang Zuo
This network shows the impact of papers produced by Yang Zuo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yang Zuo. The network helps show where Yang Zuo may publish in the future.
Co-authors
The 25 scholars most cited alongside Yang Zuo, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 35 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 44 | |
| 2 | 2020 | 38 | |
| 3 | 2018 | 37 | |
| 4 | 2017 | 35 | |
| 5 | 2017 | 30 | |
| 6 | 2020 | 29 | |
| 7 | 2022 | 24 | |
| 8 | 2016 | 23 | |
| 9 | 2024 | 22 | |
| 10 | 2017 | 18 | |
| 11 | 2023 | 15 | |
| 12 | 2023 | 15 | |
| 13 | 2016 | 13 | |
| 14 | 2017 | 12 | |
| 15 | 2022 | 11 | |
| 16 | 2024 | 9 | |
| 17 | 2022 | 8 | |
| 18 | Existence and Multiplicity of Positive Entire Solutions for a Class of Quasilinear Elliptic Equation | 2001 | 5 |
| 19 | 2013 | 5 | |
| 20 | 2016 | 4 |
About Yang Zuo
Yang Zuo is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Materials Chemistry, Aerospace Engineering and Civil and Structural Engineering, having authored 35 papers that have together received 428 indexed citations. Recurring topics across this work include High Entropy Alloys Studies (12 papers), Electronic Packaging and Soldering Technologies (10 papers), High-Temperature Coating Behaviors (6 papers), Shape Memory Alloy Transformations (5 papers), Aluminum Alloys Composites Properties (5 papers), 3D IC and TSV technologies (5 papers), Structural Integrity and Reliability Analysis (4 papers) and Copper Interconnects and Reliability (4 papers). The work is most often cited by research in Mechanical Engineering (249 citations), Electrical and Electronic Engineering (214 citations), Electronic, Optical and Magnetic Materials (38 citations), Building and Construction (26 citations) and Civil and Structural Engineering (41 citations). Yang Zuo has collaborated with scholars based in China, Japan and United Kingdom. Frequent co-authors include S.H. Mannan, Jun Shen, Xiaoxiong Zha, Runhua Gao, Mark Green, Huabei Peng, Yuhua Wen, Lu Xiang, Hyoung Seop Kim and Renlong Xiong. Their work appears in journals such as Materials Science and Engineering A, Materials Characterization, Acta Materialia, Journal of Alloys and Compounds and Materials Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.