Patrick McCluskey
Impact in
- Polymers and Plastics top 5%
- Polymer composites and self-healing
-
- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electrostatic Discharge in Electronics
Papers in
-
- Electronic Packaging and Soldering Technologies 48
- 3D IC and TSV technologies 23
- Silicon Carbide Semiconductor Technologies 23
- Advanced MEMS and NEMS Technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 9
-
- Heat Transfer and Optimization 18
- Heat Transfer and Boiling Studies 7
- Co-authors
- Hyunseok Oh (1 shared paper)Changwoon Han (1 shared paper)Byeng D. Youn (1 shared paper)Bongtae Han (1 shared paper)Yiping Liu (2 shared papers)Ken Gall (2 shared papers)Martin L. Dunn (2 shared papers)Avram Bar‐Cohen (12 shared papers)
- Journals
- Microelectronics Reliability (8 papers)Journal of Electronic Packaging (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)IEEE Aerospace and Electronic Systems Magazine (1 paper)
- Partner nations
- United StatesSwedenJapan
In The Last Decade
Patrick McCluskey
105 papers receiving 1.7k citations
Peers
Comparison fields: 5 of 78
- Polymers and Plastics 321
- Electrical and Electronic Engineering 1.0k
- Mechanical Engineering 599
- Materials Chemistry 310
- Automotive Engineering 77
Countries citing papers authored by Patrick McCluskey
This map shows the geographic impact of Patrick McCluskey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick McCluskey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick McCluskey more than expected).
Fields of papers citing papers by Patrick McCluskey
This network shows the impact of papers produced by Patrick McCluskey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick McCluskey. The network helps show where Patrick McCluskey may publish in the future.
Co-authors
The 25 scholars most cited alongside Patrick McCluskey, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 112 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 411 | |
| 2 | 2003 | 237 | |
| 3 | 2013 | 99 | |
| 4 | 2003 | 88 | |
| 5 | 2012 | 61 | |
| 6 | 2012 | 40 | |
| 7 | 1998 | 37 | |
| 8 | 2003 | 28 | |
| 9 | 2002 | 27 | |
| 10 | 2000 | 26 | |
| 11 | 2015 | 24 | |
| 12 | 2015 | 24 | |
| 13 | 1997 | 23 | |
| 14 | 2017 | 23 | |
| 15 | 2007 | 22 | |
| 16 | Reliability of Power Electronics Under Thermal Loading | 2012 | 21 |
| 17 | 2018 | 20 | |
| 18 | 2003 | 20 | |
| 19 | 2003 | 19 | |
| 20 | 2005 | 18 |
About Patrick McCluskey
Patrick McCluskey is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Materials Chemistry and Aerospace Engineering, having authored 112 papers that have together received 1.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (23 papers), Silicon Carbide Semiconductor Technologies (23 papers), Heat Transfer and Optimization (18 papers), Advanced MEMS and NEMS Technologies (11 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers), Heat Transfer and Boiling Studies (7 papers) and Real-time simulation and control systems (6 papers). The work is most often cited by research in Polymers and Plastics (321 citations), Electrical and Electronic Engineering (1.0k citations), Mechanical Engineering (599 citations), Materials Chemistry (310 citations) and Automotive Engineering (77 citations). Patrick McCluskey has collaborated with scholars based in United States, Sweden and Japan. Frequent co-authors include Hyunseok Oh, Changwoon Han, Byeng D. Youn, Bongtae Han, Yiping Liu, Ken Gall, Martin L. Dunn, Avram Bar‐Cohen, Peng Wang and Nicholas R. Jankowski. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Components and Packaging Technologies and IEEE Aerospace and Electronic Systems Magazine.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.