Patrick McCluskey
Impact in
- Polymers and Plastics top 5%
- Polymer composites and self-healing
-
- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
Papers in
-
- Electronic Packaging and Soldering Technologies 46
- 3D IC and TSV technologies 23
- Silicon Carbide Semiconductor Technologies 22
- Integrated Circuits and Semiconductor Failure Analysis 11
- Advanced MEMS and NEMS Technologies 11
-
- Heat Transfer and Optimization 18
- Heat Transfer and Boiling Studies 7
- Co-authors
- Yiping Liu (2 shared papers)Martin L. Dunn (2 shared papers)Ken Gall (2 shared papers)Hyunseok Oh (1 shared paper)Changwoon Han (1 shared paper)Byeng Dong Youn (1 shared paper)Bongtae Han (1 shared paper)Avram Bar‐Cohen (12 shared papers)
- Journals
- Microelectronics Reliability (8 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)Journal of Electronic Packaging (3 papers)IEEE Aerospace and Electronic Systems Magazine (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)
- Partner nations
- United StatesJapanDenmark
In The Last Decade
Patrick McCluskey
106 papers receiving 1.8k citations
Peers
Comparison fields: 5 of 83
- Polymers and Plastics 356
- Electrical and Electronic Engineering 1.1k
- Mechanical Engineering 608
- Biotechnology 62
- Materials Chemistry 336
Countries citing papers authored by Patrick McCluskey
This map shows the geographic impact of Patrick McCluskey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick McCluskey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick McCluskey more than expected).
Fields of papers citing papers by Patrick McCluskey
This network shows the impact of papers produced by Patrick McCluskey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick McCluskey. The network helps show where Patrick McCluskey may publish in the future.
Co-authors
The 25 scholars most cited alongside Patrick McCluskey, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 112 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 431 | |
| 2 | 2003 | 262 | |
| 3 | 2013 | 105 | |
| 4 | 2003 | 99 | |
| 5 | 2012 | 62 | |
| 6 | 1998 | 44 | |
| 7 | 2012 | 40 | |
| 8 | 2003 | 31 | |
| 9 | 2002 | 30 | |
| 10 | 1997 | 30 | |
| 11 | 2000 | 28 | |
| 12 | 2015 | 25 | |
| 13 | 2015 | 24 | |
| 14 | 2003 | 22 | |
| 15 | 2023 | 22 | |
| 16 | 2007 | 21 | |
| 17 | 2010 | 20 | |
| 18 | 2018 | 20 | |
| 19 | 2003 | 19 | |
| 20 | 2012 | 19 |
About Patrick McCluskey
Patrick McCluskey is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Control and Systems Engineering and Materials Chemistry, having authored 112 papers that have together received 1.9k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (46 papers), 3D IC and TSV technologies (23 papers), Silicon Carbide Semiconductor Technologies (22 papers), Heat Transfer and Optimization (18 papers), Integrated Circuits and Semiconductor Failure Analysis (11 papers), Advanced MEMS and NEMS Technologies (11 papers), Heat Transfer and Boiling Studies (7 papers) and Thermal properties of materials (6 papers). The work is most often cited by research in Polymers and Plastics (356 citations), Electrical and Electronic Engineering (1.1k citations), Mechanical Engineering (608 citations), Biotechnology (62 citations) and Materials Chemistry (336 citations). Patrick McCluskey has collaborated with scholars based in United States, Japan and Denmark. Frequent co-authors include Yiping Liu, Martin L. Dunn, Ken Gall, Hyunseok Oh, Changwoon Han, Byeng Dong Youn, Bongtae Han, Avram Bar‐Cohen, Peng Wang and Michael Gerard Pecht. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging, IEEE Aerospace and Electronic Systems Magazine and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.