T. Dishongh
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- VLSI and FPGA Design Techniques
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- Mechanical Behavior of Composites
- Fatigue and fracture mechanics
Papers in
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- Electronic Packaging and Soldering Technologies 13
- 3D IC and TSV technologies 8
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- Mechanical stress and fatigue analysis 3
- Adhesion, Friction, and Surface Interactions 3
- Numerical methods in engineering 1
- Metallurgy and Material Forming 1
- Co-authors
- Cemal Basaran (5 shared papers)Yuliang Zhao (4 shared papers)Michael J. McGrath (1 shared paper)Alexander N. Cartwright (2 shared papers)A.H. Titus (1 shared paper)Sirus Javadpour (1 shared paper)J.L. Prince (1 shared paper)John A. Szivek (1 shared paper)
- Journals
- IEEE Transactions on Advanced Packaging (2 papers)Mechanics of Materials (1 paper)Journal of Applied Physics (1 paper)Journal of Biomedical Materials Research (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)
- Partner nations
- United StatesIreland
In The Last Decade
T. Dishongh
19 papers receiving 317 citations
Peers
Comparison fields: 5 of 60
- Electrical and Electronic Engineering 215
- Mechanics of Materials 87
- Hardware and Architecture 22
- Mechanical Engineering 83
- Computer Networks and Communications 45
Countries citing papers authored by T. Dishongh
This map shows the geographic impact of T. Dishongh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Dishongh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Dishongh more than expected).
Fields of papers citing papers by T. Dishongh
This network shows the impact of papers produced by T. Dishongh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Dishongh. The network helps show where T. Dishongh may publish in the future.
Co-authors
The 25 scholars most cited alongside T. Dishongh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 75 | |
| 2 | Wireless Sensor Networks for Healthcare Applications | 2009 | 54 |
| 3 | 1999 | 29 | |
| 4 | 2017 | 29 | |
| 5 | 2004 | 27 | |
| 6 | 1996 | 21 | |
| 7 | 1998 | 21 | |
| 8 | 2002 | 14 | |
| 9 | 1998 | 11 | |
| 10 | 2006 | 11 | |
| 11 | 2002 | 10 | |
| 12 | 2002 | 8 | |
| 13 | 1997 | 8 | |
| 14 | 2006 | 6 | |
| 15 | 2002 | 5 | |
| 16 | 2006 | 4 | |
| 17 | 2006 | 3 | |
| 18 | Disturbed state concept of materials and interfaces with applications in electronic packaging | 1996 | 2 |
| 19 | 2008 | 1 | |
| 20 | 1998 | 0 |
About T. Dishongh
T. Dishongh is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Civil and Structural Engineering, Mechanical Engineering and Materials Chemistry, having authored 20 papers that have together received 339 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers), Mechanical stress and fatigue analysis (3 papers), Adhesion, Friction, and Surface Interactions (3 papers), Metal Forming Simulation Techniques (2 papers), Scientific Research and Discoveries (1 paper), Numerical methods in engineering (1 paper) and Metallurgy and Material Forming (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (215 citations), Mechanics of Materials (87 citations), Hardware and Architecture (22 citations), Mechanical Engineering (83 citations) and Computer Networks and Communications (45 citations). T. Dishongh has collaborated with scholars based in United States and Ireland. Frequent co-authors include Cemal Basaran, Yuliang Zhao, Michael J. McGrath, Alexander N. Cartwright, A.H. Titus, Sirus Javadpour, J.L. Prince, John A. Szivek, P. Anderson and Donald W. DeYoung. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Mechanics of Materials, Journal of Applied Physics, Journal of Biomedical Materials Research and IEEE Transactions on Components Packaging and Manufacturing Technology Part A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.