Michael D. Glover
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced DC-DC Converters
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
Papers in
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- Silicon Carbide Semiconductor Technologies 16
- Electromagnetic Compatibility and Noise Suppression 15
- 3D IC and TSV technologies 14
- Electronic Packaging and Soldering Technologies 12
- Advanced DC-DC Converters 8
- Multilevel Inverters and Converters 3
- Microwave Engineering and Waveguides 3
- Electrostatic Discharge in Electronics 2
- Co-authors
- H. Alan Mantooth (19 shared papers)Paul Shepherd (6 shared papers)Koji Shiozaki (4 shared papers)Sang Won Yoon (4 shared papers)Nan Zhu (2 shared papers)Dehong Xu (2 shared papers)Min Chen (2 shared papers)Ty McNutt (5 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Power Electronics (3 papers)IEEE Journal of Emerging and Selected Topics in Power Electronics (2 papers)IEEE Transactions on Industrial Electronics (1 paper)Journal of Micromechanics and Microengineering (1 paper)
- Partner nations
- United StatesChinaSwitzerland
In The Last Decade
Michael D. Glover
33 papers receiving 731 citations
Peers
Comparison fields: 5 of 37
- Electrical and Electronic Engineering 726
- Mechanical Engineering 209
- Condensed Matter Physics 52
- Ceramics and Composites 21
- Automotive Engineering 32
Countries citing papers authored by Michael D. Glover
This map shows the geographic impact of Michael D. Glover's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael D. Glover with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael D. Glover more than expected).
Fields of papers citing papers by Michael D. Glover
This network shows the impact of papers produced by Michael D. Glover. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael D. Glover. The network helps show where Michael D. Glover may publish in the future.
Co-authors
The 25 scholars most cited alongside Michael D. Glover, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 204 | |
| 2 | 2012 | 131 | |
| 3 | 2017 | 84 | |
| 4 | 2017 | 59 | |
| 5 | 2014 | 45 | |
| 6 | 2013 | 38 | |
| 7 | 2012 | 27 | |
| 8 | 2014 | 22 | |
| 9 | 2012 | 22 | |
| 10 | 2016 | 20 | |
| 11 | 2015 | 20 | |
| 12 | 2014 | 15 | |
| 13 | 2002 | 10 | |
| 14 | 2014 | 9 | |
| 15 | 2016 | 9 | |
| 16 | 2014 | 6 | |
| 17 | 2015 | 6 | |
| 18 | Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications | 2013 | 5 |
| 19 | 2011 | 5 | |
| 20 | 2016 | 4 |
About Michael D. Glover
Michael D. Glover is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Renewable Energy, Sustainability and the Environment and Electronic, Optical and Magnetic Materials, having authored 34 papers that have together received 773 indexed citations. Recurring topics across this work include Silicon Carbide Semiconductor Technologies (16 papers), Electromagnetic Compatibility and Noise Suppression (15 papers), 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (12 papers), Advanced DC-DC Converters (8 papers), Multilevel Inverters and Converters (3 papers), Microwave Engineering and Waveguides (3 papers) and Electrostatic Discharge in Electronics (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (726 citations), Mechanical Engineering (209 citations), Condensed Matter Physics (52 citations), Ceramics and Composites (21 citations) and Automotive Engineering (32 citations). Michael D. Glover has collaborated with scholars based in United States, China and Switzerland. Frequent co-authors include H. Alan Mantooth, Paul Shepherd, Koji Shiozaki, Sang Won Yoon, Nan Zhu, Dehong Xu, Min Chen, Ty McNutt, Bret Whitaker and S.S. Frank. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Power Electronics, IEEE Journal of Emerging and Selected Topics in Power Electronics, IEEE Transactions on Industrial Electronics and Journal of Micromechanics and Microengineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.