Uwe Scheuermann
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Electrostatic Discharge in Electronics
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Multilevel Inverters and Converters
- Advanced DC-DC Converters
- Automotive Engineering top 10%
Papers in
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- Silicon Carbide Semiconductor Technologies 16
- Electronic Packaging and Soldering Technologies 14
- Electromagnetic Compatibility and Noise Suppression 6
- Advancements in Semiconductor Devices and Circuit Design 5
- Electrostatic Discharge in Electronics 3
- Radiation Effects in Electronics 3
- Silicon and Solar Cell Technologies 3
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- Electrical Contact Performance and Analysis 4
- Co-authors
- Heinrich Schlangenotto (3 shared papers)Rik De Doncker (3 shared papers)Josef Lutz (3 shared papers)Ralf Schmidt (8 shared papers)U. Schilling (2 shared papers)Johannes Ströbel (1 shared paper)Fengqun Lang (1 shared paper)F. R. Keßler (1 shared paper)
- Journals
- Microelectronics Reliability (7 papers)IET Power Electronics (1 paper)EPE Journal (1 paper)CERN Document Server (European Organization for Nuclear Research) (1 paper)OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (1 paper)
- Partner nations
- GermanySwitzerland
In The Last Decade
Uwe Scheuermann
29 papers receiving 1.5k citations
Uwe Scheuermann's Hit Papers
Peers
Comparison fields: 5 of 45
- Electrical and Electronic Engineering 1.6k
- Automotive Engineering 78
- Mechanical Engineering 184
- Renewable Energy, Sustainability and the Environment 76
- Condensed Matter Physics 48
Countries citing papers authored by Uwe Scheuermann
This map shows the geographic impact of Uwe Scheuermann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Uwe Scheuermann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Uwe Scheuermann more than expected).
Fields of papers citing papers by Uwe Scheuermann
This network shows the impact of papers produced by Uwe Scheuermann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Uwe Scheuermann. The network helps show where Uwe Scheuermann may publish in the future.
Co-authors
The 8 scholars most cited alongside Uwe Scheuermann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Semiconductor Power Devices Hit paper breakdown → | 2011 | 547 |
| 2 | 2011 | 231 | |
| 3 | 2018 | 132 | |
| 4 | 2009 | 92 | |
| 5 | Using the chip as a temperature sensor — The influence of steep lateral temperature gradients on the V ce (T)-measurement | 2009 | 77 |
| 6 | 2010 | 75 | |
| 7 | 2014 | 50 | |
| 8 | Separating Failure Modes in Power Cycling Tests | 2012 | 49 |
| 9 | 2013 | 49 | |
| 10 | 2011 | 43 | |
| 11 | 2013 | 40 | |
| 12 | Low temperature joining technology - a high reliability alternative to solder contacts | 1997 | 37 |
| 13 | 2017 | 34 | |
| 14 | The Road to the Next Generation Power Module - 100% Solder Free Design | 2008 | 33 |
| 15 | Reliability of Planar SKiN Interconnect Technology | 2012 | 22 |
| 16 | Impact of solder fatigue on module lifetime in power cycling tests | 2011 | 22 |
| 17 | 2016 | 20 | |
| 18 | Investigation on Isolated Failure Mechanisms in Active Power Cycle Testing | 2015 | 19 |
| 19 | 2001 | 8 | |
| 20 | 2003 | 8 |
About Uwe Scheuermann
Uwe Scheuermann is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Atomic and Molecular Physics, and Optics and Civil and Structural Engineering, having authored 29 papers that have together received 1.6k indexed citations. Recurring topics across this work include Silicon Carbide Semiconductor Technologies (16 papers), Electronic Packaging and Soldering Technologies (14 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers), Electrical Contact Performance and Analysis (4 papers), Electrostatic Discharge in Electronics (3 papers), Radiation Effects in Electronics (3 papers) and Silicon and Solar Cell Technologies (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.6k citations), Automotive Engineering (78 citations), Mechanical Engineering (184 citations), Renewable Energy, Sustainability and the Environment (76 citations) and Condensed Matter Physics (48 citations). Uwe Scheuermann has collaborated with scholars based in Germany and Switzerland. Frequent co-authors include Heinrich Schlangenotto, Rik De Doncker, Josef Lutz, Ralf Schmidt, U. Schilling, Johannes Ströbel, Fengqun Lang and F. R. Keßler. Their work appears in journals such as Microelectronics Reliability, IET Power Electronics, EPE Journal, CERN Document Server (European Organization for Nuclear Research) and OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.