T. Kirkpatrick
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- General Materials Science top 10%
Papers in
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- Thin-Film Transistor Technologies 5
- Electronic Packaging and Soldering Technologies 2
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- Silicon Nanostructures and Photoluminescence 4
- Co-authors
- L.P. Lehman (2 shared papers)Thomas R. Bieler (2 shared papers)E. J. Cotts (2 shared papers)Hairong Jiang (1 shared paper)Michael Naughton (5 shared papers)David A. Strubbe (2 shared papers)Eric Johlin (2 shared papers)Jeffrey C. Grossman (2 shared papers)
- Journals
- Applied Physics Letters (2 papers)ACS Nano (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)physica status solidi (b) (1 paper)Physical Review Letters (1 paper)
- Partner nations
- United StatesSaudi Arabia
In The Last Decade
T. Kirkpatrick
9 papers receiving 395 citations
Peers
Comparison fields: 5 of 45
- Electrical and Electronic Engineering 346
- General Materials Science 16
- Mechanical Engineering 171
- Structural Biology 5
- Aerospace Engineering 77
Countries citing papers authored by T. Kirkpatrick
This map shows the geographic impact of T. Kirkpatrick's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Kirkpatrick with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Kirkpatrick more than expected).
Fields of papers citing papers by T. Kirkpatrick
This network shows the impact of papers produced by T. Kirkpatrick. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Kirkpatrick. The network helps show where T. Kirkpatrick may publish in the future.
Co-authors
The 25 scholars most cited alongside T. Kirkpatrick, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 214 | |
| 2 | 2006 | 77 | |
| 3 | 2009 | 39 | |
| 4 | 2015 | 32 | |
| 5 | 2012 | 30 | |
| 6 | 2010 | 11 | |
| 7 | 2014 | 3 | |
| 8 | 2016 | 1 | |
| 9 | 2015 | 1 | |
| 10 | 2016 | 0 |
About T. Kirkpatrick
T. Kirkpatrick is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Biomedical Engineering, Biophysics and Mechanical Engineering, having authored 10 papers that have together received 408 indexed citations. Recurring topics across this work include Thin-Film Transistor Technologies (5 papers), Silicon Nanostructures and Photoluminescence (4 papers), Nanowire Synthesis and Applications (3 papers), Spectroscopy Techniques in Biomedical and Chemical Research (2 papers), Ga2O3 and related materials (2 papers), Electronic Packaging and Soldering Technologies (2 papers), Advanced Welding Techniques Analysis (1 paper) and Metallurgy and Material Forming (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (346 citations), General Materials Science (16 citations), Mechanical Engineering (171 citations), Structural Biology (5 citations) and Aerospace Engineering (77 citations). T. Kirkpatrick has collaborated with scholars based in United States and Saudi Arabia. Frequent co-authors include L.P. Lehman, Thomas R. Bieler, E. J. Cotts, Hairong Jiang, Michael Naughton, David A. Strubbe, Eric Johlin, Jeffrey C. Grossman, Tonio Buonassisi and Zhiwei Ren. Their work appears in journals such as Applied Physics Letters, ACS Nano, IEEE Transactions on Components and Packaging Technologies, physica status solidi (b) and Physical Review Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.