Keith Sweatman
Impact in
- General Materials Science top 5%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 10%
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
Papers in
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- Electronic Packaging and Soldering Technologies 26
- 3D IC and TSV technologies 13
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- Intermetallics and Advanced Alloy Properties 10
- Advanced Welding Techniques Analysis 6
- Aluminum Alloys Composites Properties 3
- Co-authors
- Kazuhiro Nogita (25 shared papers)Stuart D. McDonald (21 shared papers)Shiqian Liu (3 shared papers)Tetsuro Nishimura (7 shared papers)Qinfen Gu (5 shared papers)A. K. Dahle (2 shared papers)Hideaki Tsukamoto (1 shared paper)Xin Fu Tan (8 shared papers)
In The Last Decade
Keith Sweatman
22 papers receiving 368 citations
Peers
Comparison fields: 5 of 37
- General Materials Science 26
- Mechanical Engineering 233
- Electrical and Electronic Engineering 287
- Aerospace Engineering 54
- Materials Chemistry 68
Countries citing papers authored by Keith Sweatman
This map shows the geographic impact of Keith Sweatman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Keith Sweatman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Keith Sweatman more than expected).
Fields of papers citing papers by Keith Sweatman
This network shows the impact of papers produced by Keith Sweatman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Keith Sweatman. The network helps show where Keith Sweatman may publish in the future.
Co-authors
The 23 scholars most cited alongside Keith Sweatman, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 85 | |
| 2 | 2010 | 46 | |
| 3 | 2019 | 43 | |
| 4 | 2005 | 39 | |
| 5 | 2018 | 38 | |
| 6 | 2006 | 19 | |
| 7 | 2022 | 14 | |
| 8 | 2023 | 12 | |
| 9 | 2013 | 11 | |
| 10 | 2019 | 10 | |
| 11 | 2014 | 8 | |
| 12 | 2023 | 8 | |
| 13 | 2023 | 7 | |
| 14 | Hot Air Solder Leveling in the lead-free era | 2009 | 6 |
| 15 | 2023 | 5 | |
| 16 | Grain refinement for improved lead-Free solder joint reliability | 2013 | 5 |
| 17 | 2022 | 5 | |
| 18 | 2015 | 5 | |
| 19 | 2020 | 3 | |
| 20 | 2018 | 2 |
About Keith Sweatman
Keith Sweatman is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Aerospace Engineering, General Materials Science and Mechanics of Materials, having authored 26 papers that have together received 373 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (13 papers), Intermetallics and Advanced Alloy Properties (10 papers), Aluminum Alloy Microstructure Properties (8 papers), Advanced Welding Techniques Analysis (6 papers), Metallurgical and Alloy Processes (4 papers), Aluminum Alloys Composites Properties (3 papers) and Metallurgy and Material Forming (1 paper). The work is most often cited by research in General Materials Science (26 citations), Mechanical Engineering (233 citations), Electrical and Electronic Engineering (287 citations), Aerospace Engineering (54 citations) and Materials Chemistry (68 citations). Keith Sweatman has collaborated with scholars based in Australia, Japan and Malaysia. Frequent co-authors include Kazuhiro Nogita, Stuart D. McDonald, Shiqian Liu, Tetsuro Nishimura, Qinfen Gu, A. K. Dahle, Hideaki Tsukamoto, Xin Fu Tan, J. Read and Dong Qu. Their work appears in journals such as Journal of Electronic Materials, Microelectronics Reliability, Materials, Scripta Materialia and Philosophical Magazine Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.