J. Read
Impact in
- General Materials Science top 1%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 5%
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 21
- 3D IC and TSV technologies 4
-
- Intermetallics and Advanced Alloy Properties 8
- Aluminum Alloys Composites Properties 5
- Advanced Welding Techniques Analysis 4
- Metallurgical Processes and Thermodynamics 3
- Co-authors
- Kazuhiro Nogita (21 shared papers)Stuart D. McDonald (15 shared papers)Dekui Mu (5 shared papers)C.M. Gourlay (5 shared papers)A. K. Dahle (4 shared papers)Yueqin Wu (3 shared papers)Han Huang (3 shared papers)Qinfen Gu (3 shared papers)
- Journals
- Journal of Electronic Materials (3 papers)Scripta Materialia (2 papers)MATERIALS TRANSACTIONS (2 papers)Materials Science and Engineering A (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)
- Partner nations
- AustraliaUnited KingdomJapan
In The Last Decade
J. Read
20 papers receiving 658 citations
Peers
Comparison fields: 5 of 29
- General Materials Science 74
- Mechanical Engineering 478
- Electrical and Electronic Engineering 630
- Aerospace Engineering 147
- Atomic and Molecular Physics, and Optics 60
Countries citing papers authored by J. Read
This map shows the geographic impact of J. Read's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Read with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Read more than expected).
Fields of papers citing papers by J. Read
This network shows the impact of papers produced by J. Read. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Read. The network helps show where J. Read may publish in the future.
Co-authors
The 16 scholars most cited alongside J. Read, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 21 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 94 | |
| 2 | 2012 | 71 | |
| 3 | 2011 | 70 | |
| 4 | 2011 | 52 | |
| 5 | 2009 | 48 | |
| 6 | 2014 | 46 | |
| 7 | 2009 | 42 | |
| 8 | 2005 | 39 | |
| 9 | 2007 | 37 | |
| 10 | 2013 | 37 | |
| 11 | 2012 | 29 | |
| 12 | 2012 | 29 | |
| 13 | 2013 | 29 | |
| 14 | 2008 | 23 | |
| 15 | 2016 | 6 | |
| 16 | Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces | 2009 | 5 |
| 17 | 2016 | 5 | |
| 18 | 2016 | 3 | |
| 19 | Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates | 2009 | 2 |
| 20 | 2016 | 1 |
About J. Read
J. Read is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Aerospace Engineering, General Materials Science and Materials Chemistry, having authored 21 papers that have together received 668 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (21 papers), Aluminum Alloy Microstructure Properties (8 papers), Intermetallics and Advanced Alloy Properties (8 papers), Aluminum Alloys Composites Properties (5 papers), Metallurgical and Alloy Processes (5 papers), 3D IC and TSV technologies (4 papers), Advanced Welding Techniques Analysis (4 papers) and Metallurgical Processes and Thermodynamics (3 papers). The work is most often cited by research in General Materials Science (74 citations), Mechanical Engineering (478 citations), Electrical and Electronic Engineering (630 citations), Aerospace Engineering (147 citations) and Atomic and Molecular Physics, and Optics (60 citations). J. Read has collaborated with scholars based in Australia, United Kingdom and Japan. Frequent co-authors include Kazuhiro Nogita, Stuart D. McDonald, Dekui Mu, C.M. Gourlay, A. K. Dahle, Yueqin Wu, Han Huang, Qinfen Gu, Tetsuro Nishimura and Guang Zeng. Their work appears in journals such as Journal of Electronic Materials, Scripta Materialia, MATERIALS TRANSACTIONS, Materials Science and Engineering A and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.