Y.C. Liu
About
Y.C. Liu has authored 21 papers that have received a total of 406 indexed citations.
This includes 16 papers in Mechanical Engineering, 11 papers in Materials Chemistry and 7 papers in Electrical and Electronic Engineering. The topics of these papers are Intermetallics and Advanced Alloy Properties (9 papers), Electronic Packaging and Soldering Technologies (7 papers) and 3D IC and TSV technologies (4 papers). Y.C. Liu is often cited by papers focused on Intermetallics and Advanced Alloy Properties (9 papers), Electronic Packaging and Soldering Technologies (7 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in China and Switzerland. Y.C. Liu's co-authors include Xiaoqiang Cai, D.P. Wang and Liming Yu and has published in prestigious journals such as Corrosion Science, Fuel and Chemical Engineering Science.
In The Last Decade
Fields of papers published by Y.C. Liu
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Y.C. Liu
Since SpecializationCitations
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