John Parry
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Mechanical Engineering top 10%
- Heat Transfer and Optimization
Papers in
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- Heat Transfer and Optimization 17
-
- Electronic Packaging and Soldering Technologies 14
- Silicon Carbide Semiconductor Technologies 5
- 3D IC and TSV technologies 5
- Electromagnetic Compatibility and Noise Suppression 4
- Electrostatic Discharge in Electronics 3
- Co-authors
- H.I. Rosten (7 shared papers)Clemens Lasance (5 shared papers)Robin Bornoff (10 shared papers)John P. Wilson (4 shared papers)Jukka Rantala (2 shared papers)Péter Szabó (3 shared papers)A. Poppe (3 shared papers)Vladimı́r Székely (2 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (3 papers)SAE technical papers on CD-ROM/SAE technical paper series (1 paper)Microelectronics Reliability (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (3 papers)Computing & Control Engineering Journal (1 paper)
- Partner nations
- United KingdomUnited StatesNetherlands
In The Last Decade
John Parry
31 papers receiving 506 citations
Peers
Comparison fields: 5 of 52
- Electrical and Electronic Engineering 364
- Mechanical Engineering 227
- Statistics, Probability and Uncertainty 29
- Statistical and Nonlinear Physics 46
- Condensed Matter Physics 41
Countries citing papers authored by John Parry
This map shows the geographic impact of John Parry's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Parry with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Parry more than expected).
Fields of papers citing papers by John Parry
This network shows the impact of papers produced by John Parry. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Parry. The network helps show where John Parry may publish in the future.
Co-authors
The 25 scholars most cited alongside John Parry, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 32 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 79 | |
| 2 | 1997 | 76 | |
| 3 | 1997 | 63 | |
| 4 | 2002 | 34 | |
| 5 | 2002 | 31 | |
| 6 | 2015 | 30 | |
| 7 | 1998 | 29 | |
| 8 | 2002 | 29 | |
| 9 | 2016 | 22 | |
| 10 | 2001 | 21 | |
| 11 | 2002 | 20 | |
| 12 | 2004 | 17 | |
| 13 | 2002 | 15 | |
| 14 | 2007 | 10 | |
| 15 | 2011 | 9 | |
| 16 | 2016 | 8 | |
| 17 | 2017 | 8 | |
| 18 | 2004 | 7 | |
| 19 | 2015 | 5 | |
| 20 | 2003 | 5 |
About John Parry
John Parry is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Computational Theory and Mathematics, Materials Chemistry and Automotive Engineering, having authored 32 papers that have together received 544 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (17 papers), Electronic Packaging and Soldering Technologies (14 papers), Silicon Carbide Semiconductor Technologies (5 papers), Advanced Multi-Objective Optimization Algorithms (5 papers), 3D IC and TSV technologies (5 papers), Thermal properties of materials (5 papers), Electromagnetic Compatibility and Noise Suppression (4 papers) and Electrostatic Discharge in Electronics (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (364 citations), Mechanical Engineering (227 citations), Statistics, Probability and Uncertainty (29 citations), Statistical and Nonlinear Physics (46 citations) and Condensed Matter Physics (41 citations). John Parry has collaborated with scholars based in United Kingdom, United States and Netherlands. Frequent co-authors include H.I. Rosten, Clemens Lasance, Robin Bornoff, John P. Wilson, Jukka Rantala, Péter Szabó, A. Poppe, Vladimı́r Székely, Gábor Farkas and M. Rencz. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, SAE technical papers on CD-ROM/SAE technical paper series, Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology Part A and Computing & Control Engineering Journal.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.