David Copeland
Impact in
- Mechanical Engineering top 5%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
- Refrigeration and Air Conditioning Technologies
- Computational Mechanics top 10%
- Fluid Dynamics and Turbulent Flows
Papers in
-
- Heat Transfer and Optimization 25
- Heat Transfer Mechanisms 14
- Heat Transfer and Boiling Studies 14
- Refrigeration and Air Conditioning Technologies 2
-
- Electronic Packaging and Soldering Technologies 4
- Advancements in Semiconductor Devices and Circuit Design 3
- Low-power high-performance VLSI design 3
- Green IT and Sustainability 2
- Co-authors
- Wataru Nakayama (6 shared papers)Masud Behnia (6 shared papers)Andrew M. Chan (2 shared papers)John Parry (1 shared paper)Jie Wei (1 shared paper)Martine Baelmans (1 shared paper)Clemens Lasance (1 shared paper)Jukka Rantala (1 shared paper)
- Journals
- Journal of Electronic Packaging (3 papers)Enhanced heat transfer/Journal of enhanced heat transfer (1 paper)Pediatric Dermatology (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (2 papers)대한기계학회 춘추학술대회 (1 paper)
- Partner nations
- United StatesJapanAustralia
In The Last Decade
David Copeland
27 papers receiving 421 citations
Peers
Comparison fields: 5 of 28
- Mechanical Engineering 409
- Computational Mechanics 75
- Electrical and Electronic Engineering 96
- Aerospace Engineering 39
- Hardware and Architecture 10
Countries citing papers authored by David Copeland
This map shows the geographic impact of David Copeland's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Copeland with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Copeland more than expected).
Fields of papers citing papers by David Copeland
This network shows the impact of papers produced by David Copeland. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Copeland. The network helps show where David Copeland may publish in the future.
Co-authors
The 18 scholars most cited alongside David Copeland, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 32 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 99 | |
| 2 | 1997 | 89 | |
| 3 | Manifold Microchannel Heat Sinks : Analysis and Optimization | 1995 | 30 |
| 4 | Manifold Microchannel Heat Sinks : Theory and Experiment | 1995 | 29 |
| 5 | 1996 | 27 | |
| 6 | 2016 | 26 | |
| 7 | 2002 | 23 | |
| 8 | 2001 | 21 | |
| 9 | 2003 | 19 | |
| 10 | 1995 | 14 | |
| 11 | 2003 | 13 | |
| 12 | Manifold microchannel heat sinks: Conjugate and extended models | 1998 | 11 |
| 13 | 2005 | 8 | |
| 14 | 1994 | 7 | |
| 15 | 1992 | 5 | |
| 16 | 2010 | 5 | |
| 17 | Passive phase change tower heat sink & pumped coolant technologies for next generation CPU module thermal design | 2009 | 4 |
| 18 | Cooling of Electronic Systems by Using Manifold Microchannel Heat Sinks | 1995 | 3 |
| 19 | 2004 | 3 | |
| 20 | A comparison of fin geometries for heatsinks in laminar forced convection: Part II -Optimization of staggered plate fin heatsink | 2001 | 2 |
About David Copeland
David Copeland is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Computational Mechanics, Aerospace Engineering and Statistical and Nonlinear Physics, having authored 32 papers that have together received 452 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (25 papers), Heat Transfer Mechanisms (14 papers), Heat Transfer and Boiling Studies (14 papers), Electronic Packaging and Soldering Technologies (4 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers), Low-power high-performance VLSI design (3 papers), Green IT and Sustainability (2 papers) and Refrigeration and Air Conditioning Technologies (2 papers). The work is most often cited by research in Mechanical Engineering (409 citations), Computational Mechanics (75 citations), Electrical and Electronic Engineering (96 citations), Aerospace Engineering (39 citations) and Hardware and Architecture (10 citations). David Copeland has collaborated with scholars based in United States, Japan and Australia. Frequent co-authors include Wataru Nakayama, Masud Behnia, Andrew M. Chan, John Parry, Jie Wei, Martine Baelmans, Clemens Lasance, Jukka Rantala, A. Mertol and Guoping Xu. Their work appears in journals such as Journal of Electronic Packaging, Enhanced heat transfer/Journal of enhanced heat transfer, Pediatric Dermatology, IEEE Transactions on Components Packaging and Manufacturing Technology Part A and 대한기계학회 춘추학술대회.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.