Robin Bornoff
Impact in
- Condensed Matter Physics top 10%
- GaN-based semiconductor devices and materials
- Computational Mechanics top 10%
- Heat Transfer and Numerical Methods
Papers in
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- GaN-based semiconductor devices and materials 17
-
- Heat Transfer and Numerical Methods 10
- Co-authors
- John D. Parry (11 shared papers)A. Poppe (12 shared papers)M. Rencz (12 shared papers)Vincenzo d’Alessandro (5 shared papers)Lorenzo Codecasa (5 shared papers)Alessandro Magnani (4 shared papers)Gábor Farkas (7 shared papers)Niccolo Rinaldi (4 shared papers)
- Journals
- Microelectronics Reliability (2 papers)Energies (2 papers)IEEE Transactions on Components and Packaging Technologies (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Atmospheric Environment (1 paper)
- Partner nations
- HungaryNetherlandsItaly
In The Last Decade
Robin Bornoff
38 papers receiving 391 citations
Peers
Comparison fields: 5 of 39
- Condensed Matter Physics 143
- Computational Mechanics 119
- Electrical and Electronic Engineering 146
- Mechanical Engineering 94
- Statistical and Nonlinear Physics 28
Countries citing papers authored by Robin Bornoff
This map shows the geographic impact of Robin Bornoff's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robin Bornoff with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robin Bornoff more than expected).
Fields of papers citing papers by Robin Bornoff
This network shows the impact of papers produced by Robin Bornoff. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robin Bornoff. The network helps show where Robin Bornoff may publish in the future.
Co-authors
The 16 scholars most cited alongside Robin Bornoff, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 38 | |
| 2 | 2015 | 30 | |
| 3 | 2019 | 30 | |
| 4 | 2016 | 24 | |
| 5 | 2018 | 19 | |
| 6 | 2016 | 18 | |
| 7 | 2016 | 18 | |
| 8 | 2018 | 18 | |
| 9 | 2004 | 17 | |
| 10 | 2007 | 17 | |
| 11 | 2013 | 17 | |
| 12 | 2018 | 17 | |
| 13 | 2018 | 16 | |
| 14 | 2019 | 16 | |
| 15 | 2011 | 13 | |
| 16 | 2017 | 12 | |
| 17 | 2017 | 12 | |
| 18 | Delphi4LED - From measurements to standardized multi-domain compact models of Light Emitting Diodes (LED) | 2016 | 11 |
| 19 | Accurate thermal characterization of power semiconductor packages by thermal simulation and measurements | 2011 | 10 |
| 20 | 2011 | 9 |
About Robin Bornoff
Robin Bornoff is a scholar working on Condensed Matter Physics, Computational Mechanics, Mechanical Engineering, Electrical and Electronic Engineering and Statistical and Nonlinear Physics, having authored 43 papers that have together received 445 indexed citations. Recurring topics across this work include GaN-based semiconductor devices and materials (17 papers), Silicon Carbide Semiconductor Technologies (12 papers), Heat Transfer and Optimization (11 papers), Heat Transfer and Numerical Methods (10 papers), Model Reduction and Neural Networks (4 papers), Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Advanced Multi-Objective Optimization Algorithms (2 papers). The work is most often cited by research in Condensed Matter Physics (143 citations), Computational Mechanics (119 citations), Electrical and Electronic Engineering (146 citations), Mechanical Engineering (94 citations) and Statistical and Nonlinear Physics (28 citations). Robin Bornoff has collaborated with scholars based in Hungary, Netherlands and Italy. Frequent co-authors include John D. Parry, A. Poppe, M. Rencz, Vincenzo d’Alessandro, Lorenzo Codecasa, Alessandro Magnani, Gábor Farkas, Niccolo Rinaldi, Andre G. Metzger and A. Di Bucchianico. Their work appears in journals such as Microelectronics Reliability, Energies, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Components Packaging and Manufacturing Technology and Atmospheric Environment.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.