J. Read
Impact in
- General Materials Science top 2%
- Metallurgical and Alloy Processes
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 18
-
- Metallurgical and Alloy Processes 4
- Co-authors
- Kazuhiro Nogita (20 shared papers)Stuart David McDonald (14 shared papers)Dekui Mu (4 shared papers)C.M. Gourlay (5 shared papers)Han Huang (3 shared papers)Yueqin Wu (3 shared papers)A. K. Dahle (4 shared papers)Qinfen Gu (3 shared papers)
- Journals
- Journal of Electronic Materials (3 papers)MATERIALS TRANSACTIONS (2 papers)Scripta Materialia (2 papers)Acta Materialia (1 paper)Intermetallics (1 paper)
- Partner nations
- AustraliaUnited KingdomChina
In The Last Decade
J. Read
19 papers receiving 685 citations
Peers
Comparison fields: 5 of 19
- General Materials Science 88
- Electrical and Electronic Engineering 615
- Structural Biology 11
- Mechanical Engineering 103
- Materials Chemistry 67
Countries citing papers authored by J. Read
This map shows the geographic impact of J. Read's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Read with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Read more than expected).
Fields of papers citing papers by J. Read
This network shows the impact of papers produced by J. Read. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Read. The network helps show where J. Read may publish in the future.
Co-authors
The 16 scholars most cited alongside J. Read, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 103 | |
| 2 | 2011 | 73 | |
| 3 | 2012 | 73 | |
| 4 | 2011 | 54 | |
| 5 | 2014 | 50 | |
| 6 | 2009 | 48 | |
| 7 | 2009 | 46 | |
| 8 | 2005 | 41 | |
| 9 | 2013 | 39 | |
| 10 | 2007 | 36 | |
| 11 | 2013 | 33 | |
| 12 | 2012 | 29 | |
| 13 | 2012 | 29 | |
| 14 | 2008 | 23 | |
| 15 | 2016 | 6 | |
| 16 | Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces | 2009 | 5 |
| 17 | 2016 | 5 | |
| 18 | 2016 | 3 | |
| 19 | Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates | 2009 | 2 |
| 20 | 2011 | 0 |
About J. Read
J. Read is a scholar working on Electrical and Electronic Engineering, General Materials Science, Mechanical Engineering, Materials Chemistry and Nuclear Energy and Engineering, having authored 20 papers that have together received 698 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), Intermetallics and Advanced Alloy Properties (4 papers), Metallurgical and Alloy Processes (4 papers), X-ray Diffraction in Crystallography (1 paper), Thermal Expansion and Ionic Conductivity (1 paper), Thermodynamic and Structural Properties of Metals and Alloys (1 paper) and Thermal and Kinetic Analysis (1 paper). The work is most often cited by research in General Materials Science (88 citations), Electrical and Electronic Engineering (615 citations), Structural Biology (11 citations), Mechanical Engineering (103 citations) and Materials Chemistry (67 citations). J. Read has collaborated with scholars based in Australia, United Kingdom and China. Frequent co-authors include Kazuhiro Nogita, Stuart David McDonald, Dekui Mu, C.M. Gourlay, Han Huang, Yueqin Wu, A. K. Dahle, Qinfen Gu, Tetsuro Nishimura and Guang Zeng. Their work appears in journals such as Journal of Electronic Materials, MATERIALS TRANSACTIONS, Scripta Materialia, Acta Materialia and Intermetallics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.