Henry Yang
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
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- Nanofabrication and Lithography Techniques
Papers in
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- 3D IC and TSV technologies 4
- Electronic Packaging and Soldering Technologies 3
- Semiconductor Lasers and Optical Devices 2
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- Surface Roughness and Optical Measurements 1
- Co-authors
- Paul Lee (1 shared paper)John H. Lau (4 shared papers)Cheng-Ta Ko (2 shared papers)Iris Xu (1 shared paper)Sze Pei Lim (1 shared paper)Jason Wang (1 shared paper)Dong Chen (1 shared paper)Hongying Wang (1 shared paper)
- Journals
- Journal of Micro/Nanolithography MEMS and MOEMS (1 paper)Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena (1 paper)IMAPSource Proceedings (2 papers)2022 International Electron Devices Meeting (IEDM) (1 paper)
- Partner nations
- TaiwanUnited StatesIndia
In The Last Decade
Henry Yang
6 papers receiving 16 citations
Peers
Comparison fields: 5 of 13
- Electrical and Electronic Engineering 20
- Biomedical Engineering 9
- Automotive Engineering 2
- Electronic, Optical and Magnetic Materials 3
- Polymers and Plastics 2
Countries citing papers authored by Henry Yang
This map shows the geographic impact of Henry Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Henry Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Henry Yang more than expected).
Fields of papers citing papers by Henry Yang
This network shows the impact of papers produced by Henry Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Henry Yang. The network helps show where Henry Yang may publish in the future.
Co-authors
The 25 scholars most cited alongside Henry Yang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 9 | |
| 2 | 2017 | 5 | |
| 3 | 2022 | 3 | |
| 4 | 2010 | 2 | |
| 5 | 2012 | 2 | |
| 6 | 2021 | 1 | |
| 7 | 2015 | 1 |
About Henry Yang
Henry Yang is a scholar working on Electrical and Electronic Engineering, Computational Mechanics, Biomedical Engineering, Aerospace Engineering and Surfaces, Coatings and Films, having authored 7 papers that have together received 23 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (3 papers), Semiconductor Lasers and Optical Devices (2 papers), Advanced Surface Polishing Techniques (2 papers), Optical Coatings and Gratings (1 paper), Copper Interconnects and Reliability (1 paper), Modular Robots and Swarm Intelligence (1 paper) and Surface Roughness and Optical Measurements (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (20 citations), Biomedical Engineering (9 citations), Automotive Engineering (2 citations), Electronic, Optical and Magnetic Materials (3 citations) and Polymers and Plastics (2 citations). Henry Yang has collaborated with scholars based in Taiwan, United States and India. Frequent co-authors include Paul Lee, John H. Lau, Cheng-Ta Ko, Iris Xu, Sze Pei Lim, Jason Wang, Dong Chen, Hongying Wang, Xi Cao and Yu-Min Lin. Their work appears in journals such as Journal of Micro/Nanolithography MEMS and MOEMS, Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena, IMAPSource Proceedings and 2022 International Electron Devices Meeting (IEDM).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.