Guifu Ding
Impact in
- Mechanical Engineering top 1%
- Heat Transfer and Optimization
- Heat Transfer Mechanisms
- Heat Transfer and Boiling Studies
- Biomedical Engineering top 1%
- Advanced Sensor and Energy Harvesting Materials
- Advanced Sensor Technologies Research
Papers in
-
- Advanced MEMS and NEMS Technologies 101
- 3D IC and TSV technologies 30
- Electronic Packaging and Soldering Technologies 29
- Electrodeposition and Electroless Coatings 25
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- Advanced Sensor and Energy Harvesting Materials 39
- Advanced Sensor Technologies Research 32
- Co-authors
- Guilian Wang (23 shared papers)Zhuoqing Yang (113 shared papers)Yunna Sun (63 shared papers)Yan Wang (32 shared papers)Congchun Zhang (44 shared papers)Xiaolin Zhao (28 shared papers)Hong Wang (34 shared papers)Ping Cheng (27 shared papers)
- Journals
- Journal of Micromechanics and Microengineering (30 papers)Sensors and Actuators A Physical (12 papers)Microelectronic Engineering (11 papers)Microsystem Technologies (10 papers)IEEE Sensors Journal (10 papers)
- Partner nations
- ChinaUnited StatesSouth Korea
In The Last Decade
Guifu Ding
315 papers receiving 4.8k citations
Peers
Comparison fields: 5 of 105
- Mechanical Engineering 1.8k
- Biomedical Engineering 1.9k
- Electrical and Electronic Engineering 2.3k
- Atomic and Molecular Physics, and Optics 823
- Surfaces, Coatings and Films 150
Countries citing papers authored by Guifu Ding
This map shows the geographic impact of Guifu Ding's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guifu Ding with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guifu Ding more than expected).
Fields of papers citing papers by Guifu Ding
This network shows the impact of papers produced by Guifu Ding. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guifu Ding. The network helps show where Guifu Ding may publish in the future.
Co-authors
The 25 scholars most cited alongside Guifu Ding, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 329 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 216 | |
| 2 | 2016 | 176 | |
| 3 | 2019 | 170 | |
| 4 | 2015 | 132 | |
| 5 | 2021 | 115 | |
| 6 | 2001 | 107 | |
| 7 | 2019 | 90 | |
| 8 | 2021 | 73 | |
| 9 | 2014 | 67 | |
| 10 | 2004 | 65 | |
| 11 | 2004 | 64 | |
| 12 | 2016 | 60 | |
| 13 | 2017 | 59 | |
| 14 | 2024 | 57 | |
| 15 | 2024 | 54 | |
| 16 | 2016 | 53 | |
| 17 | 2019 | 52 | |
| 18 | 2008 | 48 | |
| 19 | 2006 | 44 | |
| 20 | 2019 | 43 |
About Guifu Ding
Guifu Ding is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Atomic and Molecular Physics, and Optics and Materials Chemistry, having authored 329 papers that have together received 4.9k indexed citations. Recurring topics across this work include Advanced MEMS and NEMS Technologies (101 papers), Mechanical and Optical Resonators (62 papers), Advanced Sensor and Energy Harvesting Materials (39 papers), Advanced Sensor Technologies Research (32 papers), 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (29 papers), Heat Transfer and Optimization (27 papers) and Electrodeposition and Electroless Coatings (25 papers). The work is most often cited by research in Mechanical Engineering (1.8k citations), Biomedical Engineering (1.9k citations), Electrical and Electronic Engineering (2.3k citations), Atomic and Molecular Physics, and Optics (823 citations) and Surfaces, Coatings and Films (150 citations). Guifu Ding has collaborated with scholars based in China, United States and South Korea. Frequent co-authors include Guilian Wang, Zhuoqing Yang, Yunna Sun, Yan Wang, Congchun Zhang, Xiaolin Zhao, Hong Wang, Ping Cheng, Jinyuan Yao and Nan Qian. Their work appears in journals such as Journal of Micromechanics and Microengineering, Sensors and Actuators A Physical, Microelectronic Engineering, Microsystem Technologies and IEEE Sensors Journal.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.