Edward Engbrecht
Impact in
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- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Ferroelectric and Negative Capacitance Devices
Papers in
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- Copper Interconnects and Reliability 8
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- Semiconductor materials and devices 11
- Integrated Circuits and Semiconductor Failure Analysis 4
- 3D IC and TSV technologies 3
- Advancements in Semiconductor Devices and Circuit Design 3
- Co-authors
- John Gilbert Ekerdt (8 shared papers)Yong Sun (7 shared papers)J.M. White (3 shared papers)John White (4 shared papers)Klaus Pfeifer (3 shared papers)Juan G. Lozano (1 shared paper)Stephen Decatur Smith (2 shared papers)Joe Bennett (1 shared paper)
- Journals
- Thin Solid Films (3 papers)Journal of materials research/Pratt's guide to venture capital sources (1 paper)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (1 paper)IBM Journal of Research and Development (1 paper)ECS Transactions (1 paper)
- Partner nations
- United StatesGermanyBulgaria
In The Last Decade
Edward Engbrecht
15 papers receiving 314 citations
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 278
- Hardware and Architecture 26
- Electronic, Optical and Magnetic Materials 50
- Mechanics of Materials 63
- Materials Chemistry 79
Countries citing papers authored by Edward Engbrecht
This map shows the geographic impact of Edward Engbrecht's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Edward Engbrecht with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Edward Engbrecht more than expected).
Fields of papers citing papers by Edward Engbrecht
This network shows the impact of papers produced by Edward Engbrecht. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Edward Engbrecht. The network helps show where Edward Engbrecht may publish in the future.
Co-authors
The 25 scholars most cited alongside Edward Engbrecht, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 108 | |
| 2 | 2012 | 71 | |
| 3 | 2001 | 45 | |
| 4 | 2002 | 29 | |
| 5 | 2016 | 28 | |
| 6 | 2004 | 13 | |
| 7 | 2005 | 10 | |
| 8 | 2004 | 9 | |
| 9 | 2005 | 6 | |
| 10 | 2008 | 5 | |
| 11 | Evaluation of Cu CMP Barrier Slurries for Ultra Low-k dielectric film (k~2.4) for 45nm technology | 2011 | 3 |
| 12 | 2015 | 3 | |
| 13 | 2003 | 2 | |
| 14 | 2010 | 1 | |
| 15 | 2000 | 1 | |
| 16 | 2010 | 0 | |
| 17 | 2013 | 0 |
About Edward Engbrecht
Edward Engbrecht is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Hardware and Architecture, having authored 17 papers that have together received 334 indexed citations. Recurring topics across this work include Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (8 papers), Metal and Thin Film Mechanics (6 papers), Semiconductor materials and interfaces (4 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), 3D IC and TSV technologies (3 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers) and Diamond and Carbon-based Materials Research (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (278 citations), Hardware and Architecture (26 citations), Electronic, Optical and Magnetic Materials (50 citations), Mechanics of Materials (63 citations) and Materials Chemistry (79 citations). Edward Engbrecht has collaborated with scholars based in United States, Germany and Bulgaria. Frequent co-authors include John Gilbert Ekerdt, Yong Sun, J.M. White, John White, Klaus Pfeifer, Juan G. Lozano, Stephen Decatur Smith, Joe Bennett, James M. White and Tibor Bolom. Their work appears in journals such as Thin Solid Films, Journal of materials research/Pratt's guide to venture capital sources, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, IBM Journal of Research and Development and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.