Douglas J. DeVoto

845 citations
40 papers · 608 · h-index 14

Impact in

Papers in

Douglas J. DeVoto

38 papers receiving 588 citations

Peers

Douglas J. DeVoto
Comparison fields: 5 of 35
  • Electrical and Electronic Engineering 454
  • Safety, Risk, Reliability and Quality 82
  • Materials Chemistry 74
  • Condensed Matter Physics 18
  • Control and Systems Engineering 35
Replace Guoyou Liu with:
Guoyou Liu China
Jean-Jacques Huselstein France
Pearl A. Agyakwa United Kingdom
Rejeki Simanjorang Singapore
Zhenxian Liang United States
F. Forest France
Yichi Zhang China
Joshua J. Major United States
Olayiwola M. Alatise United Kingdom
Douglas J. DeVoto relative to Guoyou Liu China Guoyou Liu's profile →
Citations per field
00.5×2×3×4×4.6×
Guoyou Liu · 1×
Citations per year

Countries citing papers authored by Douglas J. DeVoto

Since Specialization
Citations

This map shows the geographic impact of Douglas J. DeVoto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Douglas J. DeVoto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Douglas J. DeVoto more than expected).

Fields of papers citing papers by Douglas J. DeVoto

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Douglas J. DeVoto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Douglas J. DeVoto. The network helps show where Douglas J. DeVoto may publish in the future.

Co-authors

The 25 scholars most cited alongside Douglas J. DeVoto, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Douglas J. DeVoto Line = papers co-authored together Douglas J. DeVoto links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown

Showing the 20 most-cited of 40 papers — load more, or switch the sort, to bring in the rest.

#Work
1 2018189
2 201871
3 201928
4 202323
5 201822
6 201521
7 201821
8 201820
9 202020
10 202120
11 201819
12 201718
13 201915
14 201414
15 201312
16
Trends in SiC MOSFET Threshold Voltage and ON-Resistance Measurements from Thermal Cycling and Electrical Switching Stresses
201811
17 201410
18 20098
19 20198
20 20147

About Douglas J. DeVoto

Douglas J. DeVoto is a scholar working on Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Materials Chemistry, Condensed Matter Physics and Mechanical Engineering, having authored 40 papers that have together received 608 indexed citations. Recurring topics across this work include Silicon Carbide Semiconductor Technologies (20 papers), Electronic Packaging and Soldering Technologies (19 papers), Thermal properties of materials (6 papers), Reliability and Maintenance Optimization (4 papers), Heat Transfer and Optimization (3 papers), GaN-based semiconductor devices and materials (2 papers), High voltage insulation and dielectric phenomena (1 paper) and HVDC Systems and Fault Protection (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (454 citations), Safety, Risk, Reliability and Quality (82 citations), Materials Chemistry (74 citations), Condensed Matter Physics (18 citations) and Control and Systems Engineering (35 citations). Douglas J. DeVoto has collaborated with scholars based in United States. Frequent co-authors include Faisal Khan, Abu Hanif, Joshua J. Major, Sreekant V. J. Narumanchi, Om Prakash Yadav, Joseph P. Kozak, Mark Mihalic, Khai D. T. Ngo, Patrick McCluskey and Xuhui Feng. Their work appears in journals such as IEEE Transactions on Power Electronics, IEEE Journal of Emerging and Selected Topics in Power Electronics, Journal of Electronic Packaging, International Journal of Heat and Mass Transfer and IEEE Transactions on Components Packaging and Manufacturing Technology.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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