David Kopp
Impact in
- Condensed Matter Physics top 5%
- GaN-based semiconductor devices and materials
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced DC-DC Converters
- Microwave Engineering and Waveguides
- Semiconductor materials and devices
Papers in
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- GaN-based semiconductor devices and materials 3
-
- 3D IC and TSV technologies 6
- Electronic Packaging and Soldering Technologies 2
- Microwave Engineering and Waveguides 1
- Co-authors
- Patrick Fay (9 shared papers)Dong Seup Lee (3 shared papers)Tomás Palacios (3 shared papers)Xiang Gao (2 shared papers)Shiping Guo (1 shared paper)Gary H. Bernstein (6 shared papers)Frank B. Johnson (2 shared papers)Seth T. Taylor (2 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Microwave and Wireless Components Letters (1 paper)IEEE Electron Device Letters (1 paper)IEEE Transactions on Magnetics (1 paper)Journal of Electronic Packaging (1 paper)
- Partner nations
- United States
In The Last Decade
David Kopp
11 papers receiving 357 citations
Peers
Comparison fields: 5 of 13
- Condensed Matter Physics 255
- Electrical and Electronic Engineering 89
- Electronic, Optical and Magnetic Materials 17
- Hardware and Architecture 6
- Atomic and Molecular Physics, and Optics 15
Countries citing papers authored by David Kopp
This map shows the geographic impact of David Kopp's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Kopp with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Kopp more than expected).
Fields of papers citing papers by David Kopp
This network shows the impact of papers produced by David Kopp. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Kopp. The network helps show where David Kopp may publish in the future.
Co-authors
The 24 scholars most cited alongside David Kopp, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 233 | |
| 2 | 2007 | 30 | |
| 3 | 2007 | 27 | |
| 4 | 2013 | 20 | |
| 5 | 2011 | 19 | |
| 6 | 2013 | 10 | |
| 7 | 2006 | 7 | |
| 8 | 2014 | 6 | |
| 9 | 2014 | 4 | |
| 10 | 2014 | 3 | |
| 11 | 2013 | 2 |
About David Kopp
David Kopp is a scholar working on Condensed Matter Physics, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Nuclear Energy and Engineering and Waste Management and Disposal, having authored 11 papers that have together received 361 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (6 papers), GaN-based semiconductor devices and materials (3 papers), Electronic Packaging and Soldering Technologies (2 papers), Magnetic properties of thin films (2 papers) and Microwave Engineering and Waveguides (1 paper). The work is most often cited by research in Condensed Matter Physics (255 citations), Electrical and Electronic Engineering (89 citations), Electronic, Optical and Magnetic Materials (17 citations), Hardware and Architecture (6 citations) and Atomic and Molecular Physics, and Optics (15 citations). David Kopp has collaborated with scholars based in United States. Frequent co-authors include Patrick Fay, Dong Seup Lee, Tomás Palacios, Xiang Gao, Shiping Guo, Gary H. Bernstein, Frank B. Johnson, Seth T. Taylor, Charles R. Sullivan and Weidong Li. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Microwave and Wireless Components Letters, IEEE Electron Device Letters, IEEE Transactions on Magnetics and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.