Dan Perry
Impact in
- Hardware and Architecture top 10%
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Photolithography Techniques
- Advanced Memory and Neural Computing
Papers in
-
- 3D IC and TSV technologies 10
- Integrated Circuits and Semiconductor Failure Analysis 5
- Semiconductor materials and devices 4
- Electronic Packaging and Soldering Technologies 4
- Advancements in Photolithography Techniques 3
-
- VLSI and Analog Circuit Testing 3
- Co-authors
- Wim Dehaene (2 shared papers)Michele Stucchi (2 shared papers)Guruprasad Katti (2 shared papers)Dimitrios Velenis (1 shared paper)Raymond J. McKenzie (1 shared paper)Michał Rakowski (2 shared papers)Abdelkarim Mercha (3 shared papers)Geert Van der Plas (3 shared papers)
- Journals
- The Journal of Strain Analysis for Engineering Design (3 papers)IEEE Transactions on Semiconductor Manufacturing (2 papers)IEEE Solid-State Circuits Magazine (1 paper)IEEE Journal of Solid-State Circuits (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)
- Partner nations
- BelgiumUnited KingdomUnited States
In The Last Decade
Dan Perry
16 papers receiving 532 citations
Peers
Comparison fields: 5 of 24
- Hardware and Architecture 70
- Electrical and Electronic Engineering 526
- Automotive Engineering 84
- Computer Networks and Communications 98
- Electronic, Optical and Magnetic Materials 30
Countries citing papers authored by Dan Perry
This map shows the geographic impact of Dan Perry's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dan Perry with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dan Perry more than expected).
Fields of papers citing papers by Dan Perry
This network shows the impact of papers produced by Dan Perry. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dan Perry. The network helps show where Dan Perry may publish in the future.
Co-authors
The 25 scholars most cited alongside Dan Perry, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 272 | |
| 2 | 2010 | 105 | |
| 3 | 2010 | 48 | |
| 4 | 2010 | 24 | |
| 5 | 2012 | 21 | |
| 6 | 2010 | 15 | |
| 7 | 2010 | 14 | |
| 8 | 2004 | 11 | |
| 9 | 2012 | 7 | |
| 10 | 2009 | 7 | |
| 11 | 2010 | 6 | |
| 12 | 2011 | 4 | |
| 13 | 2007 | 4 | |
| 14 | 2014 | 2 | |
| 15 | 1977 | 1 | |
| 16 | 1975 | 1 | |
| 17 | 1975 | 0 |
About Dan Perry
Dan Perry is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Automotive Engineering, Mechanical Engineering and Industrial and Manufacturing Engineering, having authored 17 papers that have together received 542 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (10 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Semiconductor materials and devices (4 papers), Electronic Packaging and Soldering Technologies (4 papers), Engineering Structural Analysis Methods (3 papers), VLSI and Analog Circuit Testing (3 papers), Advancements in Photolithography Techniques (3 papers) and Mechanical Failure Analysis and Simulation (2 papers). The work is most often cited by research in Hardware and Architecture (70 citations), Electrical and Electronic Engineering (526 citations), Automotive Engineering (84 citations), Computer Networks and Communications (98 citations) and Electronic, Optical and Magnetic Materials (30 citations). Dan Perry has collaborated with scholars based in Belgium, United Kingdom and United States. Frequent co-authors include Wim Dehaene, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Raymond J. McKenzie, Michał Rakowski, Abdelkarim Mercha, Geert Van der Plas, Riko Radojcic and Herman Oprins. Their work appears in journals such as The Journal of Strain Analysis for Engineering Design, IEEE Transactions on Semiconductor Manufacturing, IEEE Solid-State Circuits Magazine, IEEE Journal of Solid-State Circuits and Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.