D.C. Lin

628 citations
19 papers · 532 · h-index 9

Impact in

    • Aluminum Alloys Composites Properties
    • Advanced Welding Techniques Analysis
    • Welding Techniques and Residual Stresses
    • Intermetallics and Advanced Alloy Properties
    • Advanced materials and composites
    • Aluminum Alloy Microstructure Properties

Papers in

    • Aluminum Alloys Composites Properties 6
    • Welding Techniques and Residual Stresses 4
    • Advanced Welding Techniques Analysis 4
    • Intermetallics and Advanced Alloy Properties 2
    • Electronic Packaging and Soldering Technologies 11
    • 3D IC and TSV technologies 7

D.C. Lin

19 papers receiving 502 citations

Peers

D.C. Lin
Comparison fields: 5 of 29
  • Mechanical Engineering 471
  • Aerospace Engineering 145
  • General Materials Science 16
  • Electrical and Electronic Engineering 257
  • Metals and Alloys 5
Replace Rodrigo André Valenzuela Reyes with:
Rodrigo André Valenzuela Reyes Brazil
Xuewen Li China
Robert L Terpstra United States
A. Rezaee-Bazzaz Iran
Adrian Lis Japan
Alice C. Kilgo United States
O.N. Senkov United States
Young-Eui Shin South Korea
Zijie Cai United States
Yongyong Gong China
D.C. Lin relative to Rodrigo André Valenzuela Reyes Brazil Rodrigo André Valenzuela Reyes's profile →
Citations per field
00.5×10×15×22×
Rodrigo André Valenzuela Reyes · 1×
Citations per year

Countries citing papers authored by D.C. Lin

Since Specialization
Citations

This map shows the geographic impact of D.C. Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D.C. Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D.C. Lin more than expected).

Fields of papers citing papers by D.C. Lin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D.C. Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D.C. Lin. The network helps show where D.C. Lin may publish in the future.

Co-authors

The 19 scholars most cited alongside D.C. Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with D.C. Lin Line = papers co-authored together D.C. Lin links everyone, so they are left out of the graph.

All Works

19 of 19 papers shown
#Work
1 2008109
2 200383
3 200379
4 200379
5 200263
6 200923
7 200923
8 200621
9 200718
10 20028
11 20096
12 20085
13 20034
14 20083
15 20093
16 20052
17 20031
18 20031
19 20041

About D.C. Lin

D.C. Lin is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Mechanics of Materials, Aerospace Engineering and Computational Mechanics, having authored 19 papers that have together received 532 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers), Aluminum Alloys Composites Properties (6 papers), Welding Techniques and Residual Stresses (4 papers), Advanced Welding Techniques Analysis (4 papers), Aluminum Alloy Microstructure Properties (3 papers), Intermetallics and Advanced Alloy Properties (2 papers) and Metallurgical and Alloy Processes (2 papers). The work is most often cited by research in Mechanical Engineering (471 citations), Aerospace Engineering (145 citations), General Materials Science (16 citations), Electrical and Electronic Engineering (257 citations) and Metals and Alloys (5 citations). D.C. Lin has collaborated with scholars based in United States, Australia and Germany. Frequent co-authors include Radovan Kovacevic, T. S. Srivatsan, G.-X. Wang, M. Petraroli, Meslet Al‐Hajri, T. S. Srivatsan, Ehsan Foroozmehr, Fanrong Kong, Soundarapandian Santhanakrishnan and Guixue Wang. Their work appears in journals such as Materials Science and Engineering A, Journal of Materials Engineering and Performance, Materials Letters, Journal of Materials Processing Technology and Sadhana.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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