Fan-Yi Ouyang
About
Fan-Yi Ouyang has authored 48 papers that have received a total of 1.0k indexed citations.
This includes 33 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 15 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (19 papers) and Copper Interconnects and Reliability (15 papers). Fan-Yi Ouyang is often cited by papers focused on Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (19 papers) and Copper Interconnects and Reliability (15 papers) and collaborates with scholars based in Taiwan, United States and Hong Kong. Fan-Yi Ouyang's co-authors include Ji‐Jung Kai, Tao‐Chih Chang, Tsung‐Kuang Yeh, Wan-Hsuan Lin and Tsung-Han Yang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.
In The Last Decade
Explore authors with similar magnitude of impact
Breakdown of academic impact, for papers by Javier Martínez-Calderón Breakdown of academic impact, for papers by Susanne Blank Breakdown of academic impact, for papers by Neil R. Feins Breakdown of academic impact, for papers by Christoph Schröder Breakdown of academic impact, for papers by Shumin Liu Breakdown of academic impact, for papers by Bo Qu Breakdown of academic impact, for papers by Ronald S. Carson Breakdown of academic impact, for papers by Keisuke Kobayashi