Han-wen Lin

8 papers and 499 indexed citations i.

About

Han-wen Lin has authored 8 papers that have received a total of 499 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 4 papers in Electronic, Optical and Magnetic Materials and 3 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Copper Interconnects and Reliability (4 papers) and Intermetallics and Advanced Alloy Properties (2 papers). Han-wen Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Copper Interconnects and Reliability (4 papers) and Intermetallics and Advanced Alloy Properties (2 papers) and collaborates with scholars based in Taiwan and United States. Han-wen Lin's co-authors include Chih Chen, Chien-Min Liu, Chia-Ling Lu, Jui‐Chao Kuo and Yi-Sa Huang and has published in prestigious journals such as Science, Acta Materialia and Scientific Reports.

In The Last Decade

Fields of papers published by Han-wen Lin

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Han-wen Lin

Since Specialization
Citations
Rankless by CCL
2025