Chenlin Yang
Impact in
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- Adsorption and biosorption for pollutant removal
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
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- Electronic Packaging and Soldering Technologies 11
- 3D IC and TSV technologies 9
- Advancements in Battery Materials 3
- Electrodeposition and Electroless Coatings 3
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- Aluminum Alloys Composites Properties 2
- Co-authors
- Tao Hang (9 shared papers)Anmin Hu (10 shared papers)C. R. Kao (1 shared paper)C. Key Chung (1 shared paper)Huiqin Ling (10 shared papers)Xiaoqing Wang (1 shared paper)Shuang Yuan (1 shared paper)Jingming Gong (1 shared paper)
In The Last Decade
Chenlin Yang
22 papers receiving 333 citations
Peers
Comparison fields: 5 of 51
- Water Science and Technology 51
- Electrical and Electronic Engineering 198
- Electronic, Optical and Magnetic Materials 63
- Mechanical Engineering 106
- Electrochemistry 10
Countries citing papers authored by Chenlin Yang
This map shows the geographic impact of Chenlin Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chenlin Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chenlin Yang more than expected).
Fields of papers citing papers by Chenlin Yang
This network shows the impact of papers produced by Chenlin Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chenlin Yang. The network helps show where Chenlin Yang may publish in the future.
Co-authors
The 25 scholars most cited alongside Chenlin Yang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 22 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 63 | |
| 2 | 2012 | 53 | |
| 3 | 2019 | 28 | |
| 4 | 2017 | 25 | |
| 5 | 2021 | 21 | |
| 6 | 2014 | 20 | |
| 7 | 2018 | 19 | |
| 8 | 2017 | 19 | |
| 9 | 2018 | 17 | |
| 10 | 2020 | 13 | |
| 11 | 2019 | 11 | |
| 12 | 2020 | 11 | |
| 13 | 2021 | 7 | |
| 14 | 2022 | 7 | |
| 15 | 2021 | 6 | |
| 16 | 2020 | 6 | |
| 17 | 2022 | 6 | |
| 18 | 2020 | 3 | |
| 19 | 2024 | 3 | |
| 20 | 2021 | 3 |
About Chenlin Yang
Chenlin Yang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Molecular Biology, having authored 22 papers that have together received 343 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (9 papers), Advancements in Battery Materials (3 papers), Supercapacitor Materials and Fabrication (3 papers), Electrodeposition and Electroless Coatings (3 papers), Copper Interconnects and Reliability (3 papers), Aluminum Alloys Composites Properties (2 papers) and Advanced Surface Polishing Techniques (2 papers). The work is most often cited by research in Water Science and Technology (51 citations), Electrical and Electronic Engineering (198 citations), Electronic, Optical and Magnetic Materials (63 citations), Mechanical Engineering (106 citations) and Electrochemistry (10 citations). Chenlin Yang has collaborated with scholars based in China, Canada and Taiwan. Frequent co-authors include Tao Hang, Anmin Hu, C. R. Kao, C. Key Chung, Huiqin Ling, Xiaoqing Wang, Shuang Yuan, Jingming Gong, Xianluo Hu and Liming Gao. Their work appears in journals such as Materials Characterization, Journal of Alloys and Compounds, Electronic Materials Letters, Microelectronics Reliability and Materials Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.