C. Key Chung
Impact in
- General Materials Science top 10%
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 15
- 3D IC and TSV technologies 13
-
- Advanced Welding Techniques Analysis 5
- Intermetallics and Advanced Alloy Properties 5
- Co-authors
- C. R. Kao (13 shared papers)Jenq‐Gong Duh (1 shared paper)Alexandra Navrotsky (4 shared papers)Maik Lang (3 shared papers)Chenlin Yang (1 shared paper)Tsung‐Lin Yang (4 shared papers)Hongwu Xu (3 shared papers)Eric C. O’Quinn (2 shared papers)
- Journals
- Acta Materialia (4 papers)Scripta Materialia (2 papers)Journal of Electronic Materials (2 papers)Metallurgical and Materials Transactions A (1 paper)Journal of Nuclear Materials (1 paper)
- Partner nations
- TaiwanUnited StatesMalaysia
In The Last Decade
C. Key Chung
21 papers receiving 378 citations
Peers
Comparison fields: 5 of 26
- General Materials Science 16
- Electrical and Electronic Engineering 282
- Mechanical Engineering 180
- Condensed Matter Physics 46
- Materials Chemistry 115
Countries citing papers authored by C. Key Chung
This map shows the geographic impact of C. Key Chung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Key Chung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Key Chung more than expected).
Fields of papers citing papers by C. Key Chung
This network shows the impact of papers produced by C. Key Chung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Key Chung. The network helps show where C. Key Chung may publish in the future.
Co-authors
The 25 scholars most cited alongside C. Key Chung, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 22 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 53 | |
| 2 | 2010 | 47 | |
| 3 | 2017 | 37 | |
| 4 | 2012 | 34 | |
| 5 | 2011 | 33 | |
| 6 | 2012 | 26 | |
| 7 | 2014 | 25 | |
| 8 | 2019 | 23 | |
| 9 | 2019 | 21 | |
| 10 | 2018 | 21 | |
| 11 | 2003 | 13 | |
| 12 | 2012 | 9 | |
| 13 | 2014 | 9 | |
| 14 | 2013 | 8 | |
| 15 | 2010 | 8 | |
| 16 | 2003 | 7 | |
| 17 | 2014 | 5 | |
| 18 | 2013 | 3 | |
| 19 | 2004 | 2 | |
| 20 | 2013 | 1 |
About C. Key Chung
C. Key Chung is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Condensed Matter Physics and Electronic, Optical and Magnetic Materials, having authored 22 papers that have together received 386 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (13 papers), Advanced Welding Techniques Analysis (5 papers), Intermetallics and Advanced Alloy Properties (5 papers), Advanced Condensed Matter Physics (3 papers), Nuclear materials and radiation effects (3 papers), Copper Interconnects and Reliability (3 papers) and Nuclear Materials and Properties (2 papers). The work is most often cited by research in General Materials Science (16 citations), Electrical and Electronic Engineering (282 citations), Mechanical Engineering (180 citations), Condensed Matter Physics (46 citations) and Materials Chemistry (115 citations). C. Key Chung has collaborated with scholars based in Taiwan, United States and Malaysia. Frequent co-authors include C. R. Kao, Jenq‐Gong Duh, Alexandra Navrotsky, Maik Lang, Chenlin Yang, Tsung‐Lin Yang, Hongwu Xu, Eric C. O’Quinn, Anna Shelyug and Jacob Shamblin. Their work appears in journals such as Acta Materialia, Scripta Materialia, Journal of Electronic Materials, Metallurgical and Materials Transactions A and Journal of Nuclear Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.