V. Govind

439 citations
27 papers · 321 · h-index 11

Impact in

    • Advanced Antenna and Metasurface Technologies
    • Electromagnetic Compatibility and Noise Suppression
    • Microwave Engineering and Waveguides
    • Radio Frequency Integrated Circuit Design
    • 3D IC and TSV technologies
    • Electromagnetic Compatibility and Measurements
    • Electrostatic Discharge in Electronics

Papers in

    • Radio Frequency Integrated Circuit Design 11
    • Microwave Engineering and Waveguides 10
    • Electromagnetic Compatibility and Noise Suppression 10
    • Electrostatic Discharge in Electronics 5
    • Electromagnetic Compatibility and Measurements 5
    • Advanced Power Amplifier Design 4
    • 3D IC and TSV technologies 3
    • Bluetooth and Wireless Communication Technologies 3

V. Govind

27 papers receiving 290 citations

Peers

V. Govind
Comparison fields: 5 of 22
  • Aerospace Engineering 166
  • Electrical and Electronic Engineering 304
  • Electronic, Optical and Magnetic Materials 48
  • Biomedical Engineering 28
  • Polymers and Plastics 8
Replace Zeeshan Qamar with:
Zeeshan Qamar United States
Mohsen Karamirad Iran
Ya Fei Wu China
Francesco Foglia Manzillo France
Mohd Fairus Mohd Yusoff Malaysia
Xu Qin China
Zhicheng Lin Macao
M. Degiorgi Italy
Mohammad Bemani Iran
Sasmita Dash India
V. Govind relative to Zeeshan Qamar United States Zeeshan Qamar's profile →
Citations per field
00.5×1.6×
Zeeshan Qamar · 1×
Citations per year

Countries citing papers authored by V. Govind

Since Specialization
Citations

This map shows the geographic impact of V. Govind's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Govind with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Govind more than expected).

Fields of papers citing papers by V. Govind

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by V. Govind. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Govind. The network helps show where V. Govind may publish in the future.

Co-authors

The 25 scholars most cited alongside V. Govind, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with V. Govind Line = papers co-authored together V. Govind links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown

Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.

#Work
1 200571
2 200933
3 200429
4 200524
5 200520
6 200714
7 200714
8 200514
9 200611
10 200710
11 200410
12 20049
13 20048
14 20048
15 20067
16 20057
17 20087
18 20035
19 20044
20 20064

About V. Govind

V. Govind is a scholar working on Electrical and Electronic Engineering, Computer Networks and Communications, Biomedical Engineering, Aerospace Engineering and Materials Chemistry, having authored 27 papers that have together received 321 indexed citations. Recurring topics across this work include Radio Frequency Integrated Circuit Design (11 papers), Microwave Engineering and Waveguides (10 papers), Electromagnetic Compatibility and Noise Suppression (10 papers), Electrostatic Discharge in Electronics (5 papers), Electromagnetic Compatibility and Measurements (5 papers), Advanced Power Amplifier Design (4 papers), Bluetooth and Wireless Communication Technologies (3 papers) and 3D IC and TSV technologies (3 papers). The work is most often cited by research in Aerospace Engineering (166 citations), Electrical and Electronic Engineering (304 citations), Electronic, Optical and Magnetic Materials (48 citations), Biomedical Engineering (28 citations) and Polymers and Plastics (8 citations). V. Govind has collaborated with scholars based in United States, South Korea and India. Frequent co-authors include Madhavan Swaminathan, Jinwoo Choi, S. Dalmia, Jin‐Woo Choi, G. Edward White, Krishna Bharath, V. Sundaram, Lixi Wan, Rao Tummala and Dong Gun Kam. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Transactions on Components and Packaging Technologies, Procedia Structural Integrity, IEEE MTT-S International Microwave Symposium digest and IEEE MTT-S International Microwave Symposium Digest, 2005..

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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