V. Govind
Impact in
- Aerospace Engineering top 10%
- Advanced Antenna and Metasurface Technologies
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- Electromagnetic Compatibility and Noise Suppression
- Microwave Engineering and Waveguides
- Radio Frequency Integrated Circuit Design
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Measurements
- Electrostatic Discharge in Electronics
Papers in
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- Radio Frequency Integrated Circuit Design 11
- Microwave Engineering and Waveguides 10
- Electromagnetic Compatibility and Noise Suppression 10
- Electrostatic Discharge in Electronics 5
- Electromagnetic Compatibility and Measurements 5
- Advanced Power Amplifier Design 4
- 3D IC and TSV technologies 3
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- Bluetooth and Wireless Communication Technologies 3
- Co-authors
- Madhavan Swaminathan (18 shared papers)Jinwoo Choi (5 shared papers)S. Dalmia (12 shared papers)Jin‐Woo Choi (2 shared papers)Krishna Bharath (1 shared paper)G. Edward White (10 shared papers)V. Sundaram (5 shared papers)Lixi Wan (2 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)IEEE Transactions on Components and Packaging Technologies (1 paper)Procedia Structural Integrity (1 paper)IEEE MTT-S International Microwave Symposium digest (1 paper)Advances in economics, business and management research (1 paper)
- Partner nations
- United StatesIndiaGermany
In The Last Decade
V. Govind
28 papers receiving 304 citations
Peers
Comparison fields: 5 of 23
- Aerospace Engineering 172
- Electrical and Electronic Engineering 311
- Electronic, Optical and Magnetic Materials 53
- Biomedical Engineering 31
- Polymers and Plastics 9
Countries citing papers authored by V. Govind
This map shows the geographic impact of V. Govind's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Govind with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Govind more than expected).
Fields of papers citing papers by V. Govind
This network shows the impact of papers produced by V. Govind. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Govind. The network helps show where V. Govind may publish in the future.
Co-authors
The 25 scholars most cited alongside V. Govind, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 71 | |
| 2 | 2009 | 34 | |
| 3 | 2004 | 31 | |
| 4 | 2005 | 25 | |
| 5 | 2005 | 22 | |
| 6 | 2007 | 17 | |
| 7 | 2005 | 15 | |
| 8 | 2007 | 14 | |
| 9 | 2006 | 12 | |
| 10 | 2004 | 11 | |
| 11 | 2007 | 10 | |
| 12 | 2004 | 9 | |
| 13 | 2004 | 9 | |
| 14 | 2004 | 8 | |
| 15 | 2005 | 8 | |
| 16 | 2006 | 7 | |
| 17 | 2008 | 7 | |
| 18 | 2003 | 5 | |
| 19 | 2004 | 4 | |
| 20 | 2006 | 4 |
About V. Govind
V. Govind is a scholar working on Electrical and Electronic Engineering, Computer Networks and Communications, Biomedical Engineering, Aerospace Engineering and Materials Chemistry, having authored 28 papers that have together received 336 indexed citations. Recurring topics across this work include Radio Frequency Integrated Circuit Design (11 papers), Microwave Engineering and Waveguides (10 papers), Electromagnetic Compatibility and Noise Suppression (10 papers), Electrostatic Discharge in Electronics (5 papers), Electromagnetic Compatibility and Measurements (5 papers), Advanced Power Amplifier Design (4 papers), Bluetooth and Wireless Communication Technologies (3 papers) and 3D IC and TSV technologies (3 papers). The work is most often cited by research in Aerospace Engineering (172 citations), Electrical and Electronic Engineering (311 citations), Electronic, Optical and Magnetic Materials (53 citations), Biomedical Engineering (31 citations) and Polymers and Plastics (9 citations). V. Govind has collaborated with scholars based in United States, India and Germany. Frequent co-authors include Madhavan Swaminathan, Jinwoo Choi, S. Dalmia, Jin‐Woo Choi, Krishna Bharath, G. Edward White, V. Sundaram, Lixi Wan, Rao Tummala and I.R. Abothu. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Transactions on Components and Packaging Technologies, Procedia Structural Integrity, IEEE MTT-S International Microwave Symposium digest and Advances in economics, business and management research.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.