P.M. Raj
Impact in
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- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Microwave Engineering and Waveguides
- Electronic Packaging and Soldering Technologies
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- Dielectric materials and actuators
- Advanced Sensor and Energy Harvesting Materials
Papers in
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- 3D IC and TSV technologies 5
- Electronic Packaging and Soldering Technologies 4
- Semiconductor Lasers and Optical Devices 3
- Semiconductor materials and devices 3
- Electromagnetic Compatibility and Noise Suppression 3
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- Dielectric materials and actuators 7
- Advanced Sensor and Energy Harvesting Materials 3
- Co-authors
- Rao Tummala (19 shared papers)D. Balaraman (13 shared papers)Swapan Kumar Bhattacharya (8 shared papers)Madhavan Swaminathan (11 shared papers)Swapan Kumar Bhattacharya (5 shared papers)I.R. Abothu (11 shared papers)Lixi Wan (8 shared papers)Srikrishna Sitaraman (3 shared papers)
- Journals
- American Journal of Industrial Medicine (2 papers)Journal of Electroceramics (1 paper)IEEE Transactions on Advanced Packaging (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)
- Partner nations
- United StatesIndiaCanada
In The Last Decade
P.M. Raj
24 papers receiving 393 citations
Peers
Comparison fields: 5 of 60
- Electrical and Electronic Engineering 240
- Biomedical Engineering 142
- Materials Chemistry 126
- Electronic, Optical and Magnetic Materials 48
- Polymers and Plastics 34
Countries citing papers authored by P.M. Raj
This map shows the geographic impact of P.M. Raj's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P.M. Raj with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P.M. Raj more than expected).
Fields of papers citing papers by P.M. Raj
This network shows the impact of papers produced by P.M. Raj. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P.M. Raj. The network helps show where P.M. Raj may publish in the future.
Co-authors
The 25 scholars most cited alongside P.M. Raj, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 116 | |
| 2 | 2003 | 83 | |
| 3 | 2005 | 23 | |
| 4 | 2015 | 22 | |
| 5 | 2002 | 20 | |
| 6 | 2006 | 18 | |
| 7 | 2007 | 17 | |
| 8 | 2004 | 16 | |
| 9 | 2003 | 13 | |
| 10 | 2006 | 12 | |
| 11 | 2013 | 11 | |
| 12 | 2004 | 11 | |
| 13 | 2005 | 9 | |
| 14 | 2004 | 9 | |
| 15 | 2005 | 7 | |
| 16 | 2020 | 7 | |
| 17 | 2005 | 6 | |
| 18 | 2005 | 5 | |
| 19 | 2006 | 3 | |
| 20 | 2004 | 2 |
About P.M. Raj
P.M. Raj is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Materials Chemistry, Surgery and Polymers and Plastics, having authored 26 papers that have together received 417 indexed citations. Recurring topics across this work include Ferroelectric and Piezoelectric Materials (9 papers), Dielectric materials and actuators (7 papers), 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (4 papers), Advanced Sensor and Energy Harvesting Materials (3 papers), Semiconductor Lasers and Optical Devices (3 papers), Semiconductor materials and devices (3 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (240 citations), Biomedical Engineering (142 citations), Materials Chemistry (126 citations), Electronic, Optical and Magnetic Materials (48 citations) and Polymers and Plastics (34 citations). P.M. Raj has collaborated with scholars based in United States, India and Canada. Frequent co-authors include Rao Tummala, D. Balaraman, Swapan Kumar Bhattacharya, Madhavan Swaminathan, Swapan Kumar Bhattacharya, I.R. Abothu, Lixi Wan, Srikrishna Sitaraman, V. Sundaram and Kwang Suk Lim. Their work appears in journals such as American Journal of Industrial Medicine, Journal of Electroceramics, IEEE Transactions on Advanced Packaging, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Electronics Packaging Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.