Subin Kim
Impact in
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- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- VLSI and FPGA Design Techniques
- Advanced Memory and Neural Computing
- Semiconductor materials and devices
- Semiconductor Lasers and Optical Devices
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing
Papers in
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- 3D IC and TSV technologies 31
- Electromagnetic Compatibility and Noise Suppression 27
- Electronic Packaging and Soldering Technologies 11
- Electrostatic Discharge in Electronics 8
- Advanced Memory and Neural Computing 7
- Semiconductor materials and devices 7
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- Advanced Sensor and Energy Harvesting Materials 6
- Co-authors
- Joungho Kim (49 shared papers)Kyungjun Cho (27 shared papers)Youngwoo Kim (22 shared papers)Hyunwook Park (24 shared papers)Gapyeol Park (21 shared papers)Junyong Park (14 shared papers)Shinyoung Park (21 shared papers)Seongguk Kim (20 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (12 papers)IEEE Transactions on Electromagnetic Compatibility (3 papers)Chemical Engineering Journal (2 papers)Advanced Functional Materials (2 papers)Applied Surface Science (1 paper)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Subin Kim
73 papers receiving 706 citations
Peers
Comparison fields: 5 of 76
- Electrical and Electronic Engineering 544
- Hardware and Architecture 61
- Electronic, Optical and Magnetic Materials 70
- Polymers and Plastics 35
- Biomaterials 28
Countries citing papers authored by Subin Kim
This map shows the geographic impact of Subin Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Subin Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Subin Kim more than expected).
Fields of papers citing papers by Subin Kim
This network shows the impact of papers produced by Subin Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Subin Kim. The network helps show where Subin Kim may publish in the future.
Co-authors
The 25 scholars most cited alongside Subin Kim, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 80 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 60 | |
| 2 | 2018 | 48 | |
| 3 | 2019 | 34 | |
| 4 | 2019 | 30 | |
| 5 | 2022 | 28 | |
| 6 | 2021 | 27 | |
| 7 | 2018 | 26 | |
| 8 | 2016 | 24 | |
| 9 | 2018 | 22 | |
| 10 | 2019 | 21 | |
| 11 | 2021 | 21 | |
| 12 | 2016 | 20 | |
| 13 | 2023 | 19 | |
| 14 | 2021 | 19 | |
| 15 | 2016 | 19 | |
| 16 | 2019 | 16 | |
| 17 | 2018 | 16 | |
| 18 | 2022 | 15 | |
| 19 | 2021 | 14 | |
| 20 | 2019 | 14 |
About Subin Kim
Subin Kim is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Hardware and Architecture, Materials Chemistry and Aerospace Engineering, having authored 80 papers that have together received 723 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (31 papers), Electromagnetic Compatibility and Noise Suppression (27 papers), Electronic Packaging and Soldering Technologies (11 papers), VLSI and Analog Circuit Testing (9 papers), Electrostatic Discharge in Electronics (8 papers), Advanced Memory and Neural Computing (7 papers), Semiconductor materials and devices (7 papers) and Advanced Sensor and Energy Harvesting Materials (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (544 citations), Hardware and Architecture (61 citations), Electronic, Optical and Magnetic Materials (70 citations), Polymers and Plastics (35 citations) and Biomaterials (28 citations). Subin Kim has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Joungho Kim, Kyungjun Cho, Youngwoo Kim, Hyunwook Park, Gapyeol Park, Junyong Park, Shinyoung Park, Seongguk Kim, Daehwan Lho and Jinwook Song. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electromagnetic Compatibility, Chemical Engineering Journal, Advanced Functional Materials and Applied Surface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.