Gapyeol Park
Impact in
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- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- VLSI and FPGA Design Techniques
- Advanced Memory and Neural Computing
- Low-power high-performance VLSI design
- Semiconductor materials and devices
- Semiconductor Lasers and Optical Devices
- Hardware and Architecture top 10%
Papers in
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- 3D IC and TSV technologies 26
- Electromagnetic Compatibility and Noise Suppression 14
- Electronic Packaging and Soldering Technologies 9
- Advanced Memory and Neural Computing 6
- Semiconductor Lasers and Optical Devices 6
- Semiconductor materials and devices 6
- VLSI and FPGA Design Techniques 5
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- VLSI and Analog Circuit Testing 7
- Co-authors
- Joungho Kim (38 shared papers)Kyungjun Cho (21 shared papers)Subin Kim (21 shared papers)Hyunwook Park (27 shared papers)Shinyoung Park (17 shared papers)Youngwoo Kim (16 shared papers)Junyong Park (17 shared papers)Seongguk Kim (21 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (8 papers)IEEE Transactions on Electromagnetic Compatibility (3 papers)IEEE Transactions on Microwave Theory and Techniques (1 paper)Journal of Advanced Joining Processes (1 paper)IEEE Conference Proceedings (1 paper)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Gapyeol Park
41 papers receiving 388 citations
Peers
Comparison fields: 5 of 43
- Electrical and Electronic Engineering 344
- Hardware and Architecture 40
- Industrial and Manufacturing Engineering 18
- Instrumentation 6
- Automotive Engineering 15
Countries citing papers authored by Gapyeol Park
This map shows the geographic impact of Gapyeol Park's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gapyeol Park with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gapyeol Park more than expected).
Fields of papers citing papers by Gapyeol Park
This network shows the impact of papers produced by Gapyeol Park. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gapyeol Park. The network helps show where Gapyeol Park may publish in the future.
Co-authors
The 25 scholars most cited alongside Gapyeol Park, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 41 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 60 | |
| 2 | 2018 | 27 | |
| 3 | 2021 | 23 | |
| 4 | 2018 | 22 | |
| 5 | 2020 | 19 | |
| 6 | 2019 | 17 | |
| 7 | 2022 | 17 | |
| 8 | 2019 | 16 | |
| 9 | 2021 | 16 | |
| 10 | 2019 | 14 | |
| 11 | 2018 | 14 | |
| 12 | 2021 | 12 | |
| 13 | 2018 | 12 | |
| 14 | 2020 | 10 | |
| 15 | 2017 | 8 | |
| 16 | 2021 | 8 | |
| 17 | 2020 | 8 | |
| 18 | 2020 | 8 | |
| 19 | 2019 | 8 | |
| 20 | 2017 | 8 |
About Gapyeol Park
Gapyeol Park is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Sociology and Political Science, Cellular and Molecular Neuroscience and Computer Networks and Communications, having authored 41 papers that have together received 401 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (26 papers), Electromagnetic Compatibility and Noise Suppression (14 papers), Electronic Packaging and Soldering Technologies (9 papers), VLSI and Analog Circuit Testing (7 papers), Advanced Memory and Neural Computing (6 papers), Semiconductor Lasers and Optical Devices (6 papers), Semiconductor materials and devices (6 papers) and VLSI and FPGA Design Techniques (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (344 citations), Hardware and Architecture (40 citations), Industrial and Manufacturing Engineering (18 citations), Instrumentation (6 citations) and Automotive Engineering (15 citations). Gapyeol Park has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Joungho Kim, Kyungjun Cho, Subin Kim, Hyunwook Park, Shinyoung Park, Youngwoo Kim, Junyong Park, Seongguk Kim, Daehwan Lho and Taein Shin. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Microwave Theory and Techniques, Journal of Advanced Joining Processes and IEEE Conference Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.