Boogyo Sim
Impact in
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- Wireless Power Transfer Systems
- Energy Harvesting in Wireless Networks
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- VLSI and FPGA Design Techniques
Papers in
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- 3D IC and TSV technologies 21
- Energy Harvesting in Wireless Networks 17
- Wireless Power Transfer Systems 17
- Electromagnetic Compatibility and Noise Suppression 9
- Electronic Packaging and Soldering Technologies 4
- VLSI and FPGA Design Techniques 4
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- VLSI and Analog Circuit Testing 3
- Co-authors
- Joungho Kim (50 shared papers)H. Park (33 shared papers)Seongguk Kim (29 shared papers)Seungtaek Jeong (17 shared papers)Youngwoo Kim (9 shared papers)Subin Kim (12 shared papers)Daehwan Lho (20 shared papers)Shinyoung Park (9 shared papers)
- Journals
- IEEE Transactions on Electromagnetic Compatibility (6 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)IEEE Transactions on Microwave Theory and Techniques (1 paper)IEICE Technical Report; IEICE Tech. Rep. (1 paper)KAIST Institutional Repository (KAIST) (1 paper)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Boogyo Sim
48 papers receiving 409 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 352
- Hardware and Architecture 23
- Automotive Engineering 31
- Media Technology 17
- Industrial and Manufacturing Engineering 18
Countries citing papers authored by Boogyo Sim
This map shows the geographic impact of Boogyo Sim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Boogyo Sim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Boogyo Sim more than expected).
Fields of papers citing papers by Boogyo Sim
This network shows the impact of papers produced by Boogyo Sim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Boogyo Sim. The network helps show where Boogyo Sim may publish in the future.
Co-authors
The 25 scholars most cited alongside Boogyo Sim, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 53 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 68 | |
| 2 | 2022 | 37 | |
| 3 | 2019 | 31 | |
| 4 | 2021 | 30 | |
| 5 | 2020 | 30 | |
| 6 | 2022 | 17 | |
| 7 | 2024 | 15 | |
| 8 | 2023 | 13 | |
| 9 | 2022 | 12 | |
| 10 | 2020 | 11 | |
| 11 | 2018 | 10 | |
| 12 | 2023 | 10 | |
| 13 | 2020 | 9 | |
| 14 | 2018 | 9 | |
| 15 | 2019 | 9 | |
| 16 | 2020 | 9 | |
| 17 | 2019 | 8 | |
| 18 | 2023 | 8 | |
| 19 | 2023 | 7 | |
| 20 | 2024 | 6 |
About Boogyo Sim
Boogyo Sim is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Media Technology, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 53 papers that have together received 418 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (21 papers), Energy Harvesting in Wireless Networks (17 papers), Wireless Power Transfer Systems (17 papers), Electromagnetic Compatibility and Noise Suppression (9 papers), Wireless Body Area Networks (5 papers), Electronic Packaging and Soldering Technologies (4 papers), VLSI and FPGA Design Techniques (4 papers) and VLSI and Analog Circuit Testing (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (352 citations), Hardware and Architecture (23 citations), Automotive Engineering (31 citations), Media Technology (17 citations) and Industrial and Manufacturing Engineering (18 citations). Boogyo Sim has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Joungho Kim, H. Park, Seongguk Kim, Seungtaek Jeong, Youngwoo Kim, Subin Kim, Daehwan Lho, Shinyoung Park, Seongsoo Lee and Seokwoo Hong. Their work appears in journals such as IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Microwave Theory and Techniques, IEICE Technical Report; IEICE Tech. Rep. and KAIST Institutional Repository (KAIST).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.