R. Tilgner
Impact in
- Mechanics of Materials top 5%
- Thermography and Photoacoustic Techniques
- Ultrasonics and Acoustic Wave Propagation
- Mechanical Behavior of Composites
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Thermography and Photoacoustic Techniques 12
- Ultrasonics and Acoustic Wave Propagation 7
- Material Properties and Processing 6
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- Electronic Packaging and Soldering Technologies 16
- 3D IC and TSV technologies 12
- Integrated Circuits and Semiconductor Failure Analysis 7
- Co-authors
- P. Alpern (16 shared papers)P. Korpiun (6 shared papers)T. Baumann (6 shared papers)R. Dudek (5 shared papers)E. Lüscher (4 shared papers)Hartmut Günther (3 shared papers)M. Stecher (3 shared papers)G. Fritsch (1 shared paper)
- Journals
- Microelectronics Reliability (4 papers)IEEE Transactions on Device and Materials Reliability (3 papers)Journal of Applied Physics (2 papers)Polymer Testing (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)
- Partner nations
- GermanySingaporeUnited Kingdom
In The Last Decade
R. Tilgner
39 papers receiving 403 citations
Peers
Comparison fields: 5 of 58
- Mechanics of Materials 259
- Electrical and Electronic Engineering 195
- Biomedical Engineering 119
- Aerospace Engineering 52
- Biophysics 12
Countries citing papers authored by R. Tilgner
This map shows the geographic impact of R. Tilgner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Tilgner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Tilgner more than expected).
Fields of papers citing papers by R. Tilgner
This network shows the impact of papers produced by R. Tilgner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Tilgner. The network helps show where R. Tilgner may publish in the future.
Co-authors
The 19 scholars most cited alongside R. Tilgner, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 40 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1980 | 43 | |
| 2 | 1985 | 39 | |
| 3 | 1981 | 33 | |
| 4 | 2009 | 26 | |
| 5 | 1983 | 22 | |
| 6 | 1984 | 21 | |
| 7 | 2004 | 19 | |
| 8 | 2009 | 18 | |
| 9 | 2002 | 16 | |
| 10 | 2009 | 16 | |
| 11 | 2004 | 15 | |
| 12 | 2000 | 13 | |
| 13 | 2002 | 11 | |
| 14 | 1994 | 11 | |
| 15 | 1994 | 10 | |
| 16 | 1992 | 10 | |
| 17 | 2001 | 9 | |
| 18 | 1986 | 9 | |
| 19 | 1983 | 8 | |
| 20 | 1998 | 8 |
About R. Tilgner
R. Tilgner is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering and Materials Chemistry, having authored 40 papers that have together received 423 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), Thermography and Photoacoustic Techniques (12 papers), 3D IC and TSV technologies (12 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Photoacoustic and Ultrasonic Imaging (7 papers), Ultrasonics and Acoustic Wave Propagation (7 papers), Material Properties and Processing (6 papers) and Non-Destructive Testing Techniques (3 papers). The work is most often cited by research in Mechanics of Materials (259 citations), Electrical and Electronic Engineering (195 citations), Biomedical Engineering (119 citations), Aerospace Engineering (52 citations) and Biophysics (12 citations). R. Tilgner has collaborated with scholars based in Germany, Singapore and United Kingdom. Frequent co-authors include P. Alpern, P. Korpiun, T. Baumann, R. Dudek, E. Lüscher, Hartmut Günther, M. Stecher, G. Fritsch, K. Müller and B. Michel. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Device and Materials Reliability, Journal of Applied Physics, Polymer Testing and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.