B. Salam
Impact in
- Biomedical Engineering top 5%
- Advanced Sensor and Energy Harvesting Materials
- Wireless Body Area Networks
- Polymers and Plastics top 10%
- Conducting polymers and applications
Papers in
-
- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 11
- Nanomaterials and Printing Technologies 7
-
- Advanced Sensor and Energy Harvesting Materials 10
- Co-authors
- Xuechuan Shan (11 shared papers)Chengkuo Lee (3 shared papers)Zixuan Zhang (3 shared papers)Qiongfeng Shi (3 shared papers)Yong‐Xin Guo (3 shared papers)Kush Agarwal (2 shared papers)N.N. Ekere (8 shared papers)R. Durairaj (6 shared papers)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (2 papers)Journal of Electronic Materials (2 papers)Nature Communications (1 paper)InfoMat (1 paper)Journal of Materials Science Materials in Electronics (1 paper)
- Partner nations
- SingaporeChinaUnited Kingdom
In The Last Decade
B. Salam
36 papers receiving 958 citations
B. Salam's Hit Papers
Peers
Comparison fields: 5 of 87
- Biomedical Engineering 549
- Polymers and Plastics 174
- Cognitive Neuroscience 188
- Aerospace Engineering 250
- Human-Computer Interaction 54
Countries citing papers authored by B. Salam
This map shows the geographic impact of B. Salam's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Salam with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Salam more than expected).
Fields of papers citing papers by B. Salam
This network shows the impact of papers produced by B. Salam. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Salam. The network helps show where B. Salam may publish in the future.
Co-authors
The 25 scholars most cited alongside B. Salam, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Deep learning enabled smart mats as a scalable floor monitoring system Hit paper breakdown → | 2020 | 260 |
| 2 | 2016 | 137 | |
| 3 | 2021 | 125 | |
| 4 | 2011 | 76 | |
| 5 | 2022 | 71 | |
| 6 | 2004 | 43 | |
| 7 | 2004 | 33 | |
| 8 | 2002 | 32 | |
| 9 | 2008 | 29 | |
| 10 | 2001 | 19 | |
| 11 | 2012 | 16 | |
| 12 | 2015 | 15 | |
| 13 | 2008 | 14 | |
| 14 | 2014 | 13 | |
| 15 | 2008 | 12 | |
| 16 | 2006 | 11 | |
| 17 | 2013 | 8 | |
| 18 | 2000 | 8 | |
| 19 | 2015 | 8 | |
| 20 | 2014 | 7 |
About B. Salam
B. Salam is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Aerospace Engineering and Cognitive Neuroscience, having authored 36 papers that have together received 985 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (11 papers), Advanced Sensor and Energy Harvesting Materials (10 papers), Nanomaterials and Printing Technologies (7 papers), Advanced Antenna and Metasurface Technologies (5 papers), Antenna Design and Analysis (5 papers), Tactile and Sensory Interactions (5 papers) and Advanced Welding Techniques Analysis (4 papers). The work is most often cited by research in Biomedical Engineering (549 citations), Polymers and Plastics (174 citations), Cognitive Neuroscience (188 citations), Aerospace Engineering (250 citations) and Human-Computer Interaction (54 citations). B. Salam has collaborated with scholars based in Singapore, China and United Kingdom. Frequent co-authors include Xuechuan Shan, Chengkuo Lee, Zixuan Zhang, Qiongfeng Shi, Yong‐Xin Guo, Kush Agarwal, N.N. Ekere, R. Durairaj, Yanqin Yang and Tianyiyi He. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, Journal of Electronic Materials, Nature Communications, InfoMat and Journal of Materials Science Materials in Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.