Munshi Basit
Impact in
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
- Cellular and Composite Structures
- Advanced Welding Techniques Analysis
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
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- Electronic Packaging and Soldering Technologies 16
- 3D IC and TSV technologies 5
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- Aluminum Alloys Composites Properties 8
- Metal Forming Simulation Techniques 2
- Co-authors
- Jeffrey C. Suhling (15 shared papers)Pradeep Lall (13 shared papers)Mohammad Motalab (7 shared papers)Seong Sik Cheon (2 shared papers)Sudan Ahmed (3 shared papers)Michael J. Bozack (4 shared papers)M. S. Alam (4 shared papers)John L. Evans (3 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Mechanics of Time-Dependent Materials (1 paper)Microelectronics Reliability (1 paper)International Journal of Material Forming (1 paper)Journal of Mechanical Science and Technology (1 paper)
- Partner nations
- United StatesSouth Korea
In The Last Decade
Munshi Basit
19 papers receiving 467 citations
Peers
Comparison fields: 5 of 35
- Mechanical Engineering 268
- Electrical and Electronic Engineering 380
- Aerospace Engineering 145
- General Materials Science 13
- Mechanics of Materials 95
Countries citing papers authored by Munshi Basit
This map shows the geographic impact of Munshi Basit's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Munshi Basit with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Munshi Basit more than expected).
Fields of papers citing papers by Munshi Basit
This network shows the impact of papers produced by Munshi Basit. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Munshi Basit. The network helps show where Munshi Basit may publish in the future.
Co-authors
The 13 scholars most cited alongside Munshi Basit, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 77 | |
| 2 | 2012 | 68 | |
| 3 | 2015 | 47 | |
| 4 | 2015 | 45 | |
| 5 | 2016 | 44 | |
| 6 | 2015 | 37 | |
| 7 | 2016 | 35 | |
| 8 | 2016 | 33 | |
| 9 | 2015 | 21 | |
| 10 | 2014 | 11 | |
| 11 | 2018 | 10 | |
| 12 | 2018 | 10 | |
| 13 | 2019 | 9 | |
| 14 | 2014 | 7 | |
| 15 | 2018 | 6 | |
| 16 | 2013 | 6 | |
| 17 | 2017 | 5 | |
| 18 | 2021 | 2 | |
| 19 | 2019 | 2 | |
| 20 | 2016 | 0 |
About Munshi Basit
Munshi Basit is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Aerospace Engineering, Mechanics of Materials and Civil and Structural Engineering, having authored 20 papers that have together received 475 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), Aluminum Alloy Microstructure Properties (8 papers), Aluminum Alloys Composites Properties (8 papers), 3D IC and TSV technologies (5 papers), Metallurgy and Material Forming (4 papers), Metal Forming Simulation Techniques (2 papers), Structural Analysis and Optimization (2 papers) and Textile materials and evaluations (2 papers). The work is most often cited by research in Mechanical Engineering (268 citations), Electrical and Electronic Engineering (380 citations), Aerospace Engineering (145 citations), General Materials Science (13 citations) and Mechanics of Materials (95 citations). Munshi Basit has collaborated with scholars based in United States and South Korea. Frequent co-authors include Jeffrey C. Suhling, Pradeep Lall, Mohammad Motalab, Seong Sik Cheon, Sudan Ahmed, Michael J. Bozack, M. S. Alam, John L. Evans, Jordan C. Roberts and Jiawei Zhang. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Mechanics of Time-Dependent Materials, Microelectronics Reliability, International Journal of Material Forming and Journal of Mechanical Science and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.