John L. Evans
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Mechanical Engineering top 5%
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 50
- 3D IC and TSV technologies 35
-
- Aluminum Alloy Microstructure Properties 17
- Co-authors
- Wayne Johnson (15 shared papers)J. R. Thompson (2 shared papers)Peter Jacobsen (1 shared paper)Michael J. Bozack (20 shared papers)Jeffrey C. Suhling (16 shared papers)Pradeep Lall (11 shared papers)Jiawei Zhang (11 shared papers)Mohammad Motalab (4 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (6 papers)IEEE Transactions on Components and Packaging Technologies (3 papers)SAE technical papers on CD-ROM/SAE technical paper series (2 papers)The Journal of Finance (2 papers)Materials (2 papers)
- Partner nations
- United StatesUnited KingdomGermany
In The Last Decade
John L. Evans
70 papers receiving 1.7k citations
John L. Evans's Hit Papers
Peers
Comparison fields: 5 of 103
- Electrical and Electronic Engineering 1.3k
- Mechanical Engineering 563
- Aerospace Engineering 291
- General Materials Science 29
- Mechanics of Materials 176
Countries citing papers authored by John L. Evans
This map shows the geographic impact of John L. Evans's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John L. Evans with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John L. Evans more than expected).
Fields of papers citing papers by John L. Evans
This network shows the impact of papers produced by John L. Evans. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John L. Evans. The network helps show where John L. Evans may publish in the future.
Co-authors
The 25 scholars most cited alongside John L. Evans, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 81 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | The Changing Automotive Environment: High-Temperature Electronics Hit paper breakdown → | 2004 | 711 |
| 2 | 2012 | 89 | |
| 3 | 2013 | 87 | |
| 4 | 2013 | 86 | |
| 5 | 1971 | 63 | |
| 6 | 2015 | 49 | |
| 7 | 2015 | 46 | |
| 8 | 2006 | 32 | |
| 9 | 2004 | 30 | |
| 10 | 1997 | 30 | |
| 11 | 2022 | 30 | |
| 12 | 2012 | 29 | |
| 13 | 2017 | 28 | |
| 14 | 2018 | 27 | |
| 15 | 2004 | 26 | |
| 16 | 2005 | 25 | |
| 17 | 2004 | 25 | |
| 18 | 1998 | 22 | |
| 19 | It's just not (and not just) cricket. | 1994 | 19 |
| 20 | The Financial and Governance Characteristics of Australian Companies Going Private | 2005 | 19 |
About John L. Evans
John L. Evans is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Mechanical Engineering, Finance and Industrial and Manufacturing Engineering, having authored 81 papers that have together received 1.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (35 papers), Aluminum Alloy Microstructure Properties (17 papers), Advanced Welding Techniques Analysis (8 papers), Aluminum Alloys Composites Properties (5 papers), Capital Investment and Risk Analysis (4 papers), Manufacturing Process and Optimization (4 papers) and Industrial Vision Systems and Defect Detection (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.3k citations), Mechanical Engineering (563 citations), Aerospace Engineering (291 citations), General Materials Science (29 citations) and Mechanics of Materials (176 citations). John L. Evans has collaborated with scholars based in United States, United Kingdom and Germany. Frequent co-authors include Wayne Johnson, J. R. Thompson, Peter Jacobsen, Michael J. Bozack, Jeffrey C. Suhling, Pradeep Lall, Jiawei Zhang, Mohammad Motalab, Irwin Friend and Marshall E. Blume. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Components and Packaging Technologies, SAE technical papers on CD-ROM/SAE technical paper series, The Journal of Finance and Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.