Young-Eui Shin

46 papers and 313 indexed citations i.

Young-Eui Shin has authored 46 papers that have received a total of 313 indexed citations. This includes 42 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 6 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (25 papers) and Advanced Welding Techniques Analysis (11 papers). Young-Eui Shin is often cited by papers focused on Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (25 papers) and Advanced Welding Techniques Analysis (11 papers) and collaborates with scholars based in South Korea, Japan and United States. Young-Eui Shin's co-authors include Seung‐Boo Jung, Min-Soo Kang, Jong‐Min Kim, Sung Hyun Kim and Chang-Chae Shur and has published in prestigious journals such as Japanese Journal of Applied Physics, Materials and Sensors and Actuators A Physical.