Mohit Pathak
Impact in
- Hardware and Architecture top 5%
-
- 3D IC and TSV technologies
- Semiconductor materials and devices
- VLSI and FPGA Design Techniques
- Electronic Packaging and Soldering Technologies
- Advancements in Photolithography Techniques
- Advanced Memory and Neural Computing
Papers in
-
- 3D IC and TSV technologies 20
- VLSI and FPGA Design Techniques 12
- Power Transformer Diagnostics and Insulation 4
- Advancements in Photolithography Techniques 4
- Semiconductor materials and devices 4
- Co-authors
- Sung Kyu Lim (18 shared papers)David Zhigang Pan (3 shared papers)Jiwoo Pak (3 shared papers)Young‐Joon Lee (3 shared papers)Thomas W. Moon (2 shared papers)Arti Chandani (9 shared papers)Krit Athikulwongse (3 shared papers)Jacob Rajkumar Minz (4 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Transactions on Components and Packaging Technologies (1 paper)Chemical Engineering Journal (1 paper)Technology Analysis and Strategic Management (1 paper)IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (1 paper)
- Partner nations
- IndiaUnited StatesItaly
In The Last Decade
Mohit Pathak
34 papers receiving 591 citations
Peers
Comparison fields: 5 of 53
- Hardware and Architecture 119
- Electrical and Electronic Engineering 514
- Computer Networks and Communications 178
- Health Informatics 8
- Automotive Engineering 56
Countries citing papers authored by Mohit Pathak
This map shows the geographic impact of Mohit Pathak's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mohit Pathak with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mohit Pathak more than expected).
Fields of papers citing papers by Mohit Pathak
This network shows the impact of papers produced by Mohit Pathak. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mohit Pathak. The network helps show where Mohit Pathak may publish in the future.
Co-authors
The 25 scholars most cited alongside Mohit Pathak, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 106 | |
| 2 | 2010 | 63 | |
| 3 | 2011 | 55 | |
| 4 | 2013 | 52 | |
| 5 | 2010 | 44 | |
| 6 | 2010 | 40 | |
| 7 | 2011 | 32 | |
| 8 | 2012 | 25 | |
| 9 | 2007 | 25 | |
| 10 | 2009 | 24 | |
| 11 | 2006 | 17 | |
| 12 | 2021 | 17 | |
| 13 | 2012 | 12 | |
| 14 | 2004 | 12 | |
| 15 | 2007 | 10 | |
| 16 | 2023 | 10 | |
| 17 | 2015 | 8 | |
| 18 | 2023 | 7 | |
| 19 | Placement and Routing for 3D System-On-Package Designs | 2005 | 7 |
| 20 | 2004 | 6 |
About Mohit Pathak
Mohit Pathak is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Accounting, Computer Networks and Communications and Electronic, Optical and Magnetic Materials, having authored 43 papers that have together received 606 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (20 papers), VLSI and FPGA Design Techniques (12 papers), Interconnection Networks and Systems (6 papers), Corporate Finance and Governance (4 papers), Power Transformer Diagnostics and Insulation (4 papers), Advancements in Photolithography Techniques (4 papers), Working Capital and Financial Performance (4 papers) and Semiconductor materials and devices (4 papers). The work is most often cited by research in Hardware and Architecture (119 citations), Electrical and Electronic Engineering (514 citations), Computer Networks and Communications (178 citations), Health Informatics (8 citations) and Automotive Engineering (56 citations). Mohit Pathak has collaborated with scholars based in India, United States and Italy. Frequent co-authors include Sung Kyu Lim, David Zhigang Pan, Jiwoo Pak, Young‐Joon Lee, Thomas W. Moon, Arti Chandani, Krit Athikulwongse, Jacob Rajkumar Minz, Moongon Jung and E. H. S. WONG. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Components and Packaging Technologies, Chemical Engineering Journal, Technology Analysis and Strategic Management and IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.