Gokul Kumar
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
- Semiconductor Lasers and Optical Devices
- Microwave Engineering and Waveguides
-
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- 3D IC and TSV technologies 9
- Electronic Packaging and Soldering Technologies 6
- Electromagnetic Compatibility and Noise Suppression 4
- Advanced Power Amplifier Design 1
- Energy Harvesting in Wireless Networks 1
- Radio Frequency Integrated Circuit Design 1
-
- Nanofabrication and Lithography Techniques 4
- Co-authors
- Rao Tummala (8 shared papers)Venky Sundaram (8 shared papers)Yuya Suzuki (3 shared papers)Vijay Sukumaran (2 shared papers)Yoichiro Sato (1 shared paper)Kaya Demir (1 shared paper)Qiao Chen (2 shared papers)Tapobrata Bandyopadhyay (1 shared paper)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)Materials Science in Semiconductor Processing (1 paper)SHILAP Revista de lepidopterología (1 paper)
- Partner nations
- United StatesSouth KoreaIndia
In The Last Decade
Gokul Kumar
12 papers receiving 232 citations
Peers
Comparison fields: 5 of 23
- Electrical and Electronic Engineering 223
- Automotive Engineering 22
- Hardware and Architecture 10
- Biomedical Engineering 48
- Electronic, Optical and Magnetic Materials 19
Countries citing papers authored by Gokul Kumar
This map shows the geographic impact of Gokul Kumar's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gokul Kumar with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gokul Kumar more than expected).
Fields of papers citing papers by Gokul Kumar
This network shows the impact of papers produced by Gokul Kumar. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gokul Kumar. The network helps show where Gokul Kumar may publish in the future.
Co-authors
The 24 scholars most cited alongside Gokul Kumar, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 107 | |
| 2 | 2011 | 43 | |
| 3 | 2012 | 32 | |
| 4 | 2014 | 23 | |
| 5 | 2015 | 15 | |
| 6 | 2013 | 7 | |
| 7 | 2014 | 4 | |
| 8 | 2024 | 3 | |
| 9 | 2012 | 3 | |
| 10 | 2013 | 3 | |
| 11 | 2009 | 2 | |
| 12 | 2023 | 1 | |
| 13 | 2025 | 0 | |
| 14 | 2023 | 0 | |
| 15 | 2024 | 0 |
About Gokul Kumar
Gokul Kumar is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Aerospace Engineering, Surgery and Computer Networks and Communications, having authored 15 papers that have together received 243 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (6 papers), Nanofabrication and Lithography Techniques (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Aluminum Alloy Microstructure Properties (2 papers), Advanced Power Amplifier Design (1 paper), Energy Harvesting in Wireless Networks (1 paper) and Radio Frequency Integrated Circuit Design (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (223 citations), Automotive Engineering (22 citations), Hardware and Architecture (10 citations), Biomedical Engineering (48 citations) and Electronic, Optical and Magnetic Materials (19 citations). Gokul Kumar has collaborated with scholars based in United States, South Korea and India. Frequent co-authors include Rao Tummala, Venky Sundaram, Yuya Suzuki, Vijay Sukumaran, Yoichiro Sato, Kaya Demir, Qiao Chen, Tapobrata Bandyopadhyay, Sung Kyu Lim and Fuhan Liu. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Materials Science in Semiconductor Processing and SHILAP Revista de lepidopterología.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.