Gokul Kumar
Impact in
- Hardware and Architecture top 10%
- Parallel Computing and Optimization Techniques
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Advanced Memory and Neural Computing
Papers in
-
- 3D IC and TSV technologies 11
- Electronic Packaging and Soldering Technologies 6
- Electromagnetic Compatibility and Noise Suppression 4
- Semiconductor materials and devices 2
- Silicon Carbide Semiconductor Technologies 1
-
- Nanofabrication and Lithography Techniques 4
- Co-authors
- Venky Sundaram (8 shared papers)Rao Tummala (8 shared papers)Yuya Suzuki (3 shared papers)Vijay Sukumaran (2 shared papers)Yoichiro Sato (1 shared paper)Kaya Demir (1 shared paper)Qiao Chen (2 shared papers)Tapobrata Bandyopadhyay (1 shared paper)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Computers (1 paper)Materials Science in Semiconductor Processing (1 paper)DOAJ (DOAJ: Directory of Open Access Journals) (1 paper)
- Partner nations
- United StatesSouth KoreaNepal
In The Last Decade
Gokul Kumar
15 papers receiving 402 citations
Peers
Comparison fields: 5 of 29
- Hardware and Architecture 58
- Electrical and Electronic Engineering 378
- Automotive Engineering 35
- Computer Networks and Communications 60
- Electronic, Optical and Magnetic Materials 23
Countries citing papers authored by Gokul Kumar
This map shows the geographic impact of Gokul Kumar's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gokul Kumar with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gokul Kumar more than expected).
Fields of papers citing papers by Gokul Kumar
This network shows the impact of papers produced by Gokul Kumar. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gokul Kumar. The network helps show where Gokul Kumar may publish in the future.
Co-authors
The 23 scholars most cited alongside Gokul Kumar, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 117 | |
| 2 | 2012 | 106 | |
| 3 | 2013 | 52 | |
| 4 | 2011 | 45 | |
| 5 | 2012 | 31 | |
| 6 | 2014 | 24 | |
| 7 | 2015 | 15 | |
| 8 | 2013 | 7 | |
| 9 | 2024 | 4 | |
| 10 | 2014 | 4 | |
| 11 | 2013 | 3 | |
| 12 | 2023 | 3 | |
| 13 | 2012 | 3 | |
| 14 | 2009 | 2 | |
| 15 | 2023 | 1 | |
| 16 | 2025 | 0 | |
| 17 | 2024 | 0 |
About Gokul Kumar
Gokul Kumar is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Aerospace Engineering, Computer Networks and Communications and Hardware and Architecture, having authored 17 papers that have together received 417 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (6 papers), Nanofabrication and Lithography Techniques (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Semiconductor materials and devices (2 papers), Aluminum Alloy Microstructure Properties (2 papers), Advanced Data Storage Technologies (1 paper) and Silicon Carbide Semiconductor Technologies (1 paper). The work is most often cited by research in Hardware and Architecture (58 citations), Electrical and Electronic Engineering (378 citations), Automotive Engineering (35 citations), Computer Networks and Communications (60 citations) and Electronic, Optical and Magnetic Materials (23 citations). Gokul Kumar has collaborated with scholars based in United States, South Korea and Nepal. Frequent co-authors include Venky Sundaram, Rao Tummala, Yuya Suzuki, Vijay Sukumaran, Yoichiro Sato, Kaya Demir, Qiao Chen, Tapobrata Bandyopadhyay, Sung Kyu Lim and Fuhan Liu. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Computers, Materials Science in Semiconductor Processing and DOAJ (DOAJ: Directory of Open Access Journals).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.