Shenglin Ma
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
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- Nanopore and Nanochannel Transport Studies
- Nanofabrication and Lithography Techniques
Papers in
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- 3D IC and TSV technologies 67
- Electronic Packaging and Soldering Technologies 43
- Semiconductor materials and devices 15
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- Advanced Surface Polishing Techniques 7
- Acoustic Wave Resonator Technologies 7
- Nanofabrication and Lithography Techniques 7
- Co-authors
- Yanming Xia (23 shared papers)Yufeng Jin (37 shared papers)Yufeng Jin (30 shared papers)Lifeng Qin (6 shared papers)Min Miao (22 shared papers)Wei Zhou (1 shared paper)Junpeng Zhang (1 shared paper)Wenjun Deng (1 shared paper)
- Journals
- IEEE Transactions on Semiconductor Manufacturing (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)AIP Advances (2 papers)Journal of Micromechanics and Microengineering (2 papers)Microelectronics Reliability (2 papers)
- Partner nations
- ChinaUnited StatesSwitzerland
In The Last Decade
Shenglin Ma
96 papers receiving 666 citations
Peers
Comparison fields: 5 of 67
- Electrical and Electronic Engineering 434
- Biomedical Engineering 230
- Automotive Engineering 40
- Mechanical Engineering 123
- Catalysis 21
Countries citing papers authored by Shenglin Ma
This map shows the geographic impact of Shenglin Ma's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shenglin Ma with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shenglin Ma more than expected).
Fields of papers citing papers by Shenglin Ma
This network shows the impact of papers produced by Shenglin Ma. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shenglin Ma. The network helps show where Shenglin Ma may publish in the future.
Co-authors
The 25 scholars most cited alongside Shenglin Ma, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 106 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 79 | |
| 2 | 2020 | 73 | |
| 3 | 2022 | 31 | |
| 4 | 2013 | 30 | |
| 5 | 2018 | 26 | |
| 6 | 2022 | 26 | |
| 7 | 2008 | 20 | |
| 8 | 2021 | 19 | |
| 9 | 2016 | 16 | |
| 10 | 2021 | 15 | |
| 11 | 2022 | 12 | |
| 12 | 2016 | 12 | |
| 13 | 2022 | 12 | |
| 14 | 2019 | 12 | |
| 15 | 2009 | 11 | |
| 16 | 2018 | 11 | |
| 17 | 2010 | 9 | |
| 18 | 2022 | 9 | |
| 19 | 2013 | 9 | |
| 20 | 2011 | 9 |
About Shenglin Ma
Shenglin Ma is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials, having authored 106 papers that have together received 681 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (67 papers), Electronic Packaging and Soldering Technologies (43 papers), Semiconductor materials and devices (15 papers), Additive Manufacturing and 3D Printing Technologies (10 papers), Copper Interconnects and Reliability (9 papers), Advanced Surface Polishing Techniques (7 papers), Acoustic Wave Resonator Technologies (7 papers) and Nanofabrication and Lithography Techniques (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (434 citations), Biomedical Engineering (230 citations), Automotive Engineering (40 citations), Mechanical Engineering (123 citations) and Catalysis (21 citations). Shenglin Ma has collaborated with scholars based in China, United States and Switzerland. Frequent co-authors include Yanming Xia, Yufeng Jin, Yufeng Jin, Lifeng Qin, Min Miao, Wei Zhou, Junpeng Zhang, Wenjun Deng, Yong Tang and Jing Chen. Their work appears in journals such as IEEE Transactions on Semiconductor Manufacturing, IEEE Transactions on Components Packaging and Manufacturing Technology, AIP Advances, Journal of Micromechanics and Microengineering and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.