M. Roellig
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Mechanical Engineering top 10%
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
Papers in
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- Electronic Packaging and Soldering Technologies 67
- 3D IC and TSV technologies 35
-
- Advanced Welding Techniques Analysis 10
- Intermetallics and Advanced Alloy Properties 9
- High Temperature Alloys and Creep 9
- Aluminum Alloys Composites Properties 7
- Co-authors
- Steffen Wiese (24 shared papers)Karsten Meier (36 shared papers)Klaus‐Jürgen Wolter (12 shared papers)K.-J. Wolter (19 shared papers)Klaus-Juergen Wolter (11 shared papers)Stefan Muench (11 shared papers)Norbert Meyendorf (7 shared papers)Andreas Schießl (5 shared papers)
- Journals
- Microelectronics Reliability (5 papers)Experimental Mechanics (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)Biomechanics and Modeling in Mechanobiology (1 paper)Ultramicroscopy (1 paper)
- Partner nations
- GermanyUnited StatesBrazil
In The Last Decade
M. Roellig
86 papers receiving 611 citations
Peers
Comparison fields: 5 of 47
- Electrical and Electronic Engineering 505
- Mechanical Engineering 297
- General Materials Science 20
- Mechanics of Materials 139
- Aerospace Engineering 80
Countries citing papers authored by M. Roellig
This map shows the geographic impact of M. Roellig's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Roellig with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Roellig more than expected).
Fields of papers citing papers by M. Roellig
This network shows the impact of papers produced by M. Roellig. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Roellig. The network helps show where M. Roellig may publish in the future.
Co-authors
The 25 scholars most cited alongside M. Roellig, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 89 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 41 | |
| 2 | 2008 | 41 | |
| 3 | 2007 | 33 | |
| 4 | 2006 | 31 | |
| 5 | 2003 | 26 | |
| 6 | 2014 | 19 | |
| 7 | 2008 | 18 | |
| 8 | 2005 | 17 | |
| 9 | 2014 | 17 | |
| 10 | 2005 | 17 | |
| 11 | 2006 | 15 | |
| 12 | 2011 | 15 | |
| 13 | 2007 | 14 | |
| 14 | 2023 | 12 | |
| 15 | 2007 | 11 | |
| 16 | 2018 | 11 | |
| 17 | 2010 | 11 | |
| 18 | 2009 | 10 | |
| 19 | 2018 | 9 | |
| 20 | 2019 | 9 |
About M. Roellig
M. Roellig is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Biomedical Engineering and Aerospace Engineering, having authored 89 papers that have together received 625 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (67 papers), 3D IC and TSV technologies (35 papers), Advanced Welding Techniques Analysis (10 papers), Intermetallics and Advanced Alloy Properties (9 papers), High Temperature Alloys and Creep (9 papers), Aluminum Alloy Microstructure Properties (8 papers), Metallurgy and Material Forming (7 papers) and Aluminum Alloys Composites Properties (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (505 citations), Mechanical Engineering (297 citations), General Materials Science (20 citations), Mechanics of Materials (139 citations) and Aerospace Engineering (80 citations). M. Roellig has collaborated with scholars based in Germany, United States and Brazil. Frequent co-authors include Steffen Wiese, Karsten Meier, Klaus‐Jürgen Wolter, K.-J. Wolter, Klaus-Juergen Wolter, Stefan Muench, Norbert Meyendorf, Andreas Schießl, R. Dudek and Bernd Michel. Their work appears in journals such as Microelectronics Reliability, Experimental Mechanics, IEEE Transactions on Device and Materials Reliability, Biomechanics and Modeling in Mechanobiology and Ultramicroscopy.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.