Junhui Li
Impact in
- Materials Chemistry top 1%
- Catalytic Processes in Materials Science
- Thermal properties of materials
- Inorganic Chemistry top 2%
- Zeolite Catalysis and Synthesis
Papers in
-
- Electronic Packaging and Soldering Technologies 53
- 3D IC and TSV technologies 12
- Solid State Laser Technologies 12
- Advanced MEMS and NEMS Technologies 12
- Integrated Circuits and Semiconductor Failure Analysis 10
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- Catalytic Processes in Materials Science 32
- Co-authors
- K. Krishna (19 shared papers)William S. Epling (11 shared papers)Xiaohe Liu (22 shared papers)Di Wang (13 shared papers)Zhan Liu (12 shared papers)Wenhui Zhu (35 shared papers)Ashok Kumar (12 shared papers)Aleksey Yezerets (21 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (26 papers)Journal of Electronic Packaging (7 papers)Catalysis Today (7 papers)Optik (6 papers)Microelectronics Reliability (6 papers)
- Partner nations
- ChinaUnited StatesJapan
In The Last Decade
Junhui Li
272 papers receiving 6.6k citations
Junhui Li's Hit Papers
Peers
Comparison fields: 5 of 92
- Materials Chemistry 2.8k
- Inorganic Chemistry 500
- Electrical and Electronic Engineering 1.5k
- Fluid Flow and Transfer Processes 179
- Renewable Energy, Sustainability and the Environment 308
Countries citing papers authored by Junhui Li
This map shows the geographic impact of Junhui Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Junhui Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Junhui Li more than expected).
Fields of papers citing papers by Junhui Li
This network shows the impact of papers produced by Junhui Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Junhui Li. The network helps show where Junhui Li may publish in the future.
Co-authors
The 25 scholars most cited alongside Junhui Li, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 290 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties Hit paper breakdown → | 2020 | 456 |
| 2 | 2014 | 309 | |
| 3 | 2018 | 245 | |
| 4 | 2014 | 208 | |
| 5 | 2013 | 193 | |
| 6 | 2015 | 187 | |
| 7 | 2020 | 183 | |
| 8 | 2019 | 151 | |
| 9 | 2019 | 146 | |
| 10 | 2014 | 125 | |
| 11 | 2011 | 121 | |
| 12 | 2014 | 119 | |
| 13 | 2016 | 118 | |
| 14 | Heterostructure Interface Construction of Cobalt/Molybdenum Selenides toward Ultra‐Stable Sodium‐Ion Half/Full Batteries Hit paper breakdown → | 2024 | 104 |
| 15 | 2017 | 101 | |
| 16 | 2013 | 97 | |
| 17 | 2015 | 93 | |
| 18 | 2017 | 89 | |
| 19 | 2011 | 76 | |
| 20 | 2020 | 74 |
About Junhui Li
Junhui Li is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering, Energy Engineering and Power Technology and Condensed Matter Physics, having authored 290 papers that have together received 6.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (53 papers), Catalytic Processes in Materials Science (32 papers), 3D IC and TSV technologies (12 papers), Solid State Laser Technologies (12 papers), Advanced MEMS and NEMS Technologies (12 papers), GaN-based semiconductor devices and materials (12 papers), Integrated Circuits and Semiconductor Failure Analysis (10 papers) and Fluid Dynamics and Heat Transfer (10 papers). The work is most often cited by research in Materials Chemistry (2.8k citations), Inorganic Chemistry (500 citations), Electrical and Electronic Engineering (1.5k citations), Fluid Flow and Transfer Processes (179 citations) and Renewable Energy, Sustainability and the Environment (308 citations). Junhui Li has collaborated with scholars based in China, United States and Japan. Frequent co-authors include K. Krishna, William S. Epling, Xiaohe Liu, Di Wang, Zhan Liu, Wenhui Zhu, Ashok Kumar, Aleksey Yezerets, Neal W. Currier and Can Zhou. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging, Catalysis Today, Optik and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.