Fuliang Wang
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
- Nanomaterials and Printing Technologies
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 59
- 3D IC and TSV technologies 44
- Electrodeposition and Electroless Coatings 41
- Nanomaterials and Printing Technologies 13
- Co-authors
- Hu He (14 shared papers)Wenhui Zhu (20 shared papers)Mingqi Xiang (6 shared papers)Yan Wang (16 shared papers)Lei Han (10 shared papers)Yun Chen (11 shared papers)Hongbin Xiao (7 shared papers)Lei Han (8 shared papers)
In The Last Decade
Fuliang Wang
147 papers receiving 1.5k citations
Peers
Comparison fields: 5 of 87
- Electrical and Electronic Engineering 980
- Automotive Engineering 133
- Applied Mathematics 105
- Mechanical Engineering 294
- Biomedical Engineering 317
Countries citing papers authored by Fuliang Wang
This map shows the geographic impact of Fuliang Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fuliang Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fuliang Wang more than expected).
Fields of papers citing papers by Fuliang Wang
This network shows the impact of papers produced by Fuliang Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fuliang Wang. The network helps show where Fuliang Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Fuliang Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 153 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 76 | |
| 2 | 2016 | 48 | |
| 3 | 2017 | 34 | |
| 4 | 2016 | 33 | |
| 5 | 2017 | 33 | |
| 6 | 2017 | 33 | |
| 7 | 2020 | 32 | |
| 8 | 2016 | 32 | |
| 9 | 2023 | 31 | |
| 10 | 2016 | 31 | |
| 11 | 2017 | 29 | |
| 12 | 2008 | 29 | |
| 13 | 2011 | 26 | |
| 14 | 2014 | 25 | |
| 15 | 2017 | 25 | |
| 16 | 2019 | 21 | |
| 17 | 2017 | 21 | |
| 18 | 2019 | 20 | |
| 19 | 2016 | 19 | |
| 20 | 2018 | 18 |
About Fuliang Wang
Fuliang Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering, Materials Chemistry and Mechanics of Materials, having authored 153 papers that have together received 1.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (59 papers), 3D IC and TSV technologies (44 papers), Electrodeposition and Electroless Coatings (41 papers), Anodic Oxide Films and Nanostructures (13 papers), Nanomaterials and Printing Technologies (13 papers), Semiconductor materials and interfaces (12 papers), Adhesion, Friction, and Surface Interactions (11 papers) and Nanofabrication and Lithography Techniques (11 papers). The work is most often cited by research in Electrical and Electronic Engineering (980 citations), Automotive Engineering (133 citations), Applied Mathematics (105 citations), Mechanical Engineering (294 citations) and Biomedical Engineering (317 citations). Fuliang Wang has collaborated with scholars based in China, Hong Kong and Romania. Frequent co-authors include Hu He, Wenhui Zhu, Mingqi Xiang, Yan Wang, Lei Han, Yun Chen, Hongbin Xiao, Lei Han, Junhui Li and Feng Wang. Their work appears in journals such as Microelectronic Engineering, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Micromechanics and Microengineering, Journal of The Electrochemical Society and IEEE Transactions on Semiconductor Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.