F.G. Shi
Impact in
- Ceramics and Composites top 5%
- Glass properties and applications
- Materials Chemistry top 5%
- Luminescence Properties of Advanced Materials
- High voltage insulation and dielectric phenomena
Papers in
-
- Electronic Packaging and Soldering Technologies 22
- Semiconductor materials and devices 13
- Semiconductor Lasers and Optical Devices 11
- 3D IC and TSV technologies 11
- Photonic and Optical Devices 8
- Co-authors
- Michael Todd (4 shared papers)H.K. Kim (3 shared papers)Kikuo Okuyama (15 shared papers)Bin Zhao (15 shared papers)Qing Jiang (2 shared papers)Jiun Pyng You (2 shared papers)Ju Hyeon Choi (4 shared papers)Mikrajuddin (8 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (10 papers)Journal of Lightwave Technology (5 papers)Microelectronic Engineering (5 papers)Scripta Materialia (3 papers)Materials Science in Semiconductor Processing (3 papers)
- Partner nations
- United StatesChinaGermany
In The Last Decade
F.G. Shi
118 papers receiving 2.0k citations
Peers
Comparison fields: 5 of 107
- Ceramics and Composites 191
- Materials Chemistry 1.0k
- Electrical and Electronic Engineering 1.0k
- Polymers and Plastics 239
- Biomedical Engineering 627
Countries citing papers authored by F.G. Shi
This map shows the geographic impact of F.G. Shi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F.G. Shi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F.G. Shi more than expected).
Fields of papers citing papers by F.G. Shi
This network shows the impact of papers produced by F.G. Shi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F.G. Shi. The network helps show where F.G. Shi may publish in the future.
Co-authors
The 25 scholars most cited alongside F.G. Shi, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 127 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 119 | |
| 2 | 2005 | 116 | |
| 3 | 1998 | 100 | |
| 4 | 1998 | 99 | |
| 5 | 2009 | 89 | |
| 6 | 2001 | 78 | |
| 7 | 2005 | 76 | |
| 8 | 2009 | 75 | |
| 9 | 2001 | 70 | |
| 10 | 2001 | 64 | |
| 11 | 2003 | 63 | |
| 12 | 2000 | 57 | |
| 13 | 1999 | 53 | |
| 14 | 1999 | 49 | |
| 15 | 2008 | 48 | |
| 16 | 1998 | 38 | |
| 17 | 2001 | 37 | |
| 18 | 1995 | 36 | |
| 19 | 2000 | 29 | |
| 20 | 2005 | 29 |
About F.G. Shi
F.G. Shi is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Biomedical Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics, having authored 127 papers that have together received 2.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), Copper Interconnects and Reliability (14 papers), Force Microscopy Techniques and Applications (13 papers), Semiconductor materials and devices (13 papers), Semiconductor Lasers and Optical Devices (11 papers), 3D IC and TSV technologies (11 papers), Advanced Surface Polishing Techniques (8 papers) and Photonic and Optical Devices (8 papers). The work is most often cited by research in Ceramics and Composites (191 citations), Materials Chemistry (1.0k citations), Electrical and Electronic Engineering (1.0k citations), Polymers and Plastics (239 citations) and Biomedical Engineering (627 citations). F.G. Shi has collaborated with scholars based in United States, China and Germany. Frequent co-authors include Michael Todd, H.K. Kim, Kikuo Okuyama, Bin Zhao, Qing Jiang, Jiun Pyng You, Ju Hyeon Choi, Mikrajuddin, Ferry Iskandar and C.L. Davidson. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Journal of Lightwave Technology, Microelectronic Engineering, Scripta Materialia and Materials Science in Semiconductor Processing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.