Michael Todd
Impact in
- Polymers and Plastics top 10%
- Polymer Nanocomposites and Properties
- Biomedical Engineering top 10%
- Dielectric materials and actuators
- Advanced Sensor and Energy Harvesting Materials
Papers in
-
- Electronic Packaging and Soldering Technologies 12
- 3D IC and TSV technologies 10
-
- Material Properties and Processing 5
- Co-authors
- Frank G. Shi (2 shared papers)F.G. Shi (4 shared papers)Maurice E. Edwards (1 shared paper)Andrew A. Shapiro (1 shared paper)Linda A. Domeier (1 shared paper)Jack Zhang (1 shared paper)K. R. Desai (1 shared paper)M. Buckley (1 shared paper)
- Journals
- Tetrahedron Letters (1 paper)Journal of Applied Physics (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)Microelectronics Reliability (1 paper)IEEE Transactions on Dielectrics and Electrical Insulation (1 paper)
- Partner nations
- United StatesGermany
In The Last Decade
Michael Todd
19 papers receiving 506 citations
Peers
Comparison fields: 5 of 51
- Polymers and Plastics 173
- Biomedical Engineering 333
- Materials Chemistry 286
- Electronic, Optical and Magnetic Materials 105
- Nuclear Energy and Engineering 2
Countries citing papers authored by Michael Todd
This map shows the geographic impact of Michael Todd's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Todd with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Todd more than expected).
Fields of papers citing papers by Michael Todd
This network shows the impact of papers produced by Michael Todd. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Todd. The network helps show where Michael Todd may publish in the future.
Co-authors
The 9 scholars most cited alongside Michael Todd, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 147 | |
| 2 | 2005 | 116 | |
| 3 | 2002 | 65 | |
| 4 | 2001 | 64 | |
| 5 | 2003 | 63 | |
| 6 | 1992 | 22 | |
| 7 | 2006 | 17 | |
| 8 | 2002 | 11 | |
| 9 | 2004 | 5 | |
| 10 | 2004 | 5 | |
| 11 | 2004 | 5 | |
| 12 | 2006 | 4 | |
| 13 | 2002 | 3 | |
| 14 | 2007 | 3 | |
| 15 | 2004 | 3 | |
| 16 | Modeling and experimental study for the targeted design of dielectric properties of polymer composite materials | 2004 | 2 |
| 17 | 2002 | 2 | |
| 18 | 2004 | 2 | |
| 19 | 2005 | 1 |
About Michael Todd
Michael Todd is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Biomedical Engineering, Mechanical Engineering and Industrial and Manufacturing Engineering, having authored 19 papers that have together received 540 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers), Material Properties and Processing (5 papers), Dielectric materials and actuators (4 papers), Recycling and Waste Management Techniques (2 papers), Acoustic Wave Phenomena Research (2 papers), Epoxy Resin Curing Processes (2 papers) and Copper Interconnects and Reliability (2 papers). The work is most often cited by research in Polymers and Plastics (173 citations), Biomedical Engineering (333 citations), Materials Chemistry (286 citations), Electronic, Optical and Magnetic Materials (105 citations) and Nuclear Energy and Engineering (2 citations). Michael Todd has collaborated with scholars based in United States and Germany. Frequent co-authors include Frank G. Shi, F.G. Shi, Maurice E. Edwards, Andrew A. Shapiro, Linda A. Domeier, Jack Zhang, K. R. Desai, M. Buckley and Fan Shi. Their work appears in journals such as Tetrahedron Letters, Journal of Applied Physics, IEEE Transactions on Components and Packaging Technologies, Microelectronics Reliability and IEEE Transactions on Dielectrics and Electrical Insulation.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.