Douglas DeVoto
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Advanced DC-DC Converters
- Advancements in Semiconductor Devices and Circuit Design
Papers in
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- Electronic Packaging and Soldering Technologies 19
- Silicon Carbide Semiconductor Technologies 14
- 3D IC and TSV technologies 12
- Electromagnetic Compatibility and Noise Suppression 5
- Electrostatic Discharge in Electronics 4
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- Heat Transfer and Optimization 4
- Co-authors
- Faisal Khan (3 shared papers)Abu Hanif (3 shared papers)Joshua Major (18 shared papers)Sreekant Narumanchi (17 shared papers)Om Prakash Yadav (2 shared papers)Khai D. T. Ngo (2 shared papers)Joseph P. Kozak (2 shared papers)Mark Mihalic (5 shared papers)
- Journals
- IEEE Transactions on Power Electronics (3 papers)IEEE Journal of Emerging and Selected Topics in Power Electronics (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)International Journal of Heat and Mass Transfer (1 paper)Advanced Engineering Materials (1 paper)
- Partner nations
- United States
In The Last Decade
Douglas DeVoto
35 papers receiving 509 citations
Peers
Comparison fields: 5 of 39
- Electrical and Electronic Engineering 405
- Ceramics and Composites 32
- Mechanical Engineering 148
- Automotive Engineering 45
- Safety, Risk, Reliability and Quality 29
Countries citing papers authored by Douglas DeVoto
This map shows the geographic impact of Douglas DeVoto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Douglas DeVoto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Douglas DeVoto more than expected).
Fields of papers citing papers by Douglas DeVoto
This network shows the impact of papers produced by Douglas DeVoto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Douglas DeVoto. The network helps show where Douglas DeVoto may publish in the future.
Co-authors
The 25 scholars most cited alongside Douglas DeVoto, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 38 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 165 | |
| 2 | 2018 | 63 | |
| 3 | 2019 | 22 | |
| 4 | 2018 | 20 | |
| 5 | 2018 | 19 | |
| 6 | 2018 | 19 | |
| 7 | 2015 | 18 | |
| 8 | 2018 | 18 | |
| 9 | 2020 | 18 | |
| 10 | 2023 | 17 | |
| 11 | 2017 | 16 | |
| 12 | 2021 | 14 | |
| 13 | 2014 | 14 | |
| 14 | 2019 | 13 | |
| 15 | Trends in SiC MOSFET Threshold Voltage and ON-Resistance Measurements from Thermal Cycling and Electrical Switching Stresses | 2018 | 12 |
| 16 | 2013 | 11 | |
| 17 | 2014 | 9 | |
| 18 | 2009 | 8 | |
| 19 | 2014 | 7 | |
| 20 | 2019 | 7 |
About Douglas DeVoto
Douglas DeVoto is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Mechanics of Materials and Automotive Engineering, having authored 38 papers that have together received 533 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), Silicon Carbide Semiconductor Technologies (14 papers), 3D IC and TSV technologies (12 papers), Thermal properties of materials (9 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Electrostatic Discharge in Electronics (4 papers), Adhesion, Friction, and Surface Interactions (4 papers) and Heat Transfer and Optimization (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (405 citations), Ceramics and Composites (32 citations), Mechanical Engineering (148 citations), Automotive Engineering (45 citations) and Safety, Risk, Reliability and Quality (29 citations). Douglas DeVoto has collaborated with scholars based in United States. Frequent co-authors include Faisal Khan, Abu Hanif, Joshua Major, Sreekant Narumanchi, Om Prakash Yadav, Khai D. T. Ngo, Joseph P. Kozak, Mark Mihalic, Patrick McCluskey and Kevin Bennion. Their work appears in journals such as IEEE Transactions on Power Electronics, IEEE Journal of Emerging and Selected Topics in Power Electronics, IEEE Transactions on Components Packaging and Manufacturing Technology, International Journal of Heat and Mass Transfer and Advanced Engineering Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.