Dong-Jun Lee
Impact in
-
- Nanomaterials and Printing Technologies
- IoT Networks and Protocols
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
Papers in
-
- Semiconductor materials and devices 6
- 3D IC and TSV technologies 4
- Advancements in PLL and VCO Technologies 4
- Advancements in Semiconductor Devices and Circuit Design 4
- Electronic Packaging and Soldering Technologies 4
-
- Thermochemical Biomass Conversion Processes 4
- Advanced Sensor and Energy Harvesting Materials 3
- Co-authors
- Hak‐Sung Kim (1 shared paper)Sung-Hyeon Park (1 shared paper)Shin Jang (1 shared paper)Hyo S. Lee (1 shared paper)Eilhann E. Kwon (6 shared papers)Chiyoung Park (2 shared papers)Sungyup Jung (4 shared papers)Yiu Fai Tsang (2 shared papers)
- Journals
- Chemical Engineering Journal (3 papers)IEEE Journal of Solid-State Circuits (2 papers)Advanced Materials (2 papers)IEEE Access (2 papers)Microelectronics Reliability (1 paper)
- Partner nations
- South KoreaUnited StatesHong Kong
In The Last Decade
Dong-Jun Lee
36 papers receiving 350 citations
Peers
Comparison fields: 5 of 54
- Electrical and Electronic Engineering 207
- Water Science and Technology 38
- Renewable Energy, Sustainability and the Environment 43
- Biomedical Engineering 109
- Automotive Engineering 24
Countries citing papers authored by Dong-Jun Lee
This map shows the geographic impact of Dong-Jun Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dong-Jun Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dong-Jun Lee more than expected).
Fields of papers citing papers by Dong-Jun Lee
This network shows the impact of papers produced by Dong-Jun Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dong-Jun Lee. The network helps show where Dong-Jun Lee may publish in the future.
Co-authors
The 25 scholars most cited alongside Dong-Jun Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 39 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 57 | |
| 2 | 2022 | 50 | |
| 3 | 2023 | 47 | |
| 4 | 2006 | 19 | |
| 5 | 2012 | 15 | |
| 6 | 2018 | 14 | |
| 7 | 2018 | 13 | |
| 8 | 2024 | 12 | |
| 9 | 2019 | 12 | |
| 10 | 2023 | 10 | |
| 11 | 2024 | 9 | |
| 12 | 2024 | 9 | |
| 13 | Fabrication and Electrical Properties of Local Damascene FinFET Cell Array in Sub-60㎚ Feature Sized DRAM | 2006 | 8 |
| 14 | 2021 | 8 | |
| 15 | 2023 | 8 | |
| 16 | 2019 | 7 | |
| 17 | 2005 | 6 | |
| 18 | 2008 | 6 | |
| 19 | 2013 | 5 | |
| 20 | 2015 | 4 |
About Dong-Jun Lee
Dong-Jun Lee is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry and Computer Networks and Communications, having authored 39 papers that have together received 358 indexed citations. Recurring topics across this work include Semiconductor materials and devices (6 papers), Copper Interconnects and Reliability (5 papers), Thermochemical Biomass Conversion Processes (4 papers), 3D IC and TSV technologies (4 papers), Advancements in PLL and VCO Technologies (4 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers), Electronic Packaging and Soldering Technologies (4 papers) and Advanced Sensor and Energy Harvesting Materials (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (207 citations), Water Science and Technology (38 citations), Renewable Energy, Sustainability and the Environment (43 citations), Biomedical Engineering (109 citations) and Automotive Engineering (24 citations). Dong-Jun Lee has collaborated with scholars based in South Korea, United States and Hong Kong. Frequent co-authors include Hak‐Sung Kim, Sung-Hyeon Park, Shin Jang, Hyo S. Lee, Eilhann E. Kwon, Chiyoung Park, Sungyup Jung, Yiu Fai Tsang, Seong-Heon Cho and Jun‐Ho Jeong. Their work appears in journals such as Chemical Engineering Journal, IEEE Journal of Solid-State Circuits, Advanced Materials, IEEE Access and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.