Young-Bae Park
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Thin-Film Transistor Technologies
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- Copper Interconnects and Reliability
Papers in
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- Electronic Packaging and Soldering Technologies 105
- 3D IC and TSV technologies 70
- Semiconductor materials and devices 39
- Thin-Film Transistor Technologies 15
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- Copper Interconnects and Reliability 61
- Co-authors
- Shi‐Woo Rhee (17 shared papers)Young‐Chang Joo (26 shared papers)Harry A. Atwater (9 shared papers)Moon Byung-Hyun (1 shared paper)Kyung‐Hun Park (1 shared paper)Jaewon Kim (11 shared papers)Dong-Wha Park (3 shared papers)Byoung‐Joon Kim (9 shared papers)
- Journals
- Japanese Journal of Applied Physics (16 papers)Journal of Electronic Materials (13 papers)Electronic Materials Letters (8 papers)Journal of Materials Science Materials in Electronics (7 papers)Microelectronic Engineering (7 papers)
- Partner nations
- South KoreaUnited StatesAustralia
In The Last Decade
Young-Bae Park
163 papers receiving 2.3k citations
Peers
Comparison fields: 5 of 78
- Electrical and Electronic Engineering 1.8k
- Electronic, Optical and Magnetic Materials 547
- Materials Chemistry 733
- Mechanical Engineering 396
- Biomedical Engineering 445
Countries citing papers authored by Young-Bae Park
This map shows the geographic impact of Young-Bae Park's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Young-Bae Park with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Young-Bae Park more than expected).
Fields of papers citing papers by Young-Bae Park
This network shows the impact of papers produced by Young-Bae Park. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Young-Bae Park. The network helps show where Young-Bae Park may publish in the future.
Co-authors
The 25 scholars most cited alongside Young-Bae Park, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 174 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 119 | |
| 2 | 2010 | 111 | |
| 3 | 2008 | 106 | |
| 4 | 2009 | 77 | |
| 5 | 2003 | 75 | |
| 6 | 2009 | 65 | |
| 7 | 2006 | 65 | |
| 8 | 2001 | 64 | |
| 9 | 2005 | 55 | |
| 10 | 2005 | 52 | |
| 11 | 2010 | 49 | |
| 12 | 2021 | 48 | |
| 13 | 2014 | 47 | |
| 14 | 2008 | 44 | |
| 15 | 2008 | 43 | |
| 16 | 2011 | 39 | |
| 17 | 2006 | 38 | |
| 18 | 1996 | 37 | |
| 19 | 2011 | 37 | |
| 20 | 2011 | 29 |
About Young-Bae Park
Young-Bae Park is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Materials Chemistry and Biomedical Engineering, having authored 174 papers that have together received 2.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (105 papers), 3D IC and TSV technologies (70 papers), Copper Interconnects and Reliability (61 papers), Semiconductor materials and devices (39 papers), Advanced Welding Techniques Analysis (24 papers), Thin-Film Transistor Technologies (15 papers), Metal and Thin Film Mechanics (12 papers) and Semiconductor materials and interfaces (9 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.8k citations), Electronic, Optical and Magnetic Materials (547 citations), Materials Chemistry (733 citations), Mechanical Engineering (396 citations) and Biomedical Engineering (445 citations). Young-Bae Park has collaborated with scholars based in South Korea, United States and Australia. Frequent co-authors include Shi‐Woo Rhee, Young‐Chang Joo, Harry A. Atwater, Moon Byung-Hyun, Kyung‐Hun Park, Jaewon Kim, Dong-Wha Park, Byoung‐Joon Kim, Hak‐Joo Lee and Kiwook Lee. Their work appears in journals such as Japanese Journal of Applied Physics, Journal of Electronic Materials, Electronic Materials Letters, Journal of Materials Science Materials in Electronics and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.