Wayne R. Johnson
Impact in
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- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- Advanced MEMS and NEMS Technologies
- Aerospace Engineering top 0.5%
- Aeroelasticity and Vibration Control
- Aerospace and Aviation Technology
Papers in
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- Electronic Packaging and Soldering Technologies 105
- Silicon Carbide Semiconductor Technologies 33
- 3D IC and TSV technologies 20
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- Aeroelasticity and Vibration Control 66
- Aerospace and Aviation Technology 38
- Co-authors
- Jeff B. Casady (12 shared papers)John L. Evans (15 shared papers)Jeffrey C. Suhling (20 shared papers)J. R. Thompson (2 shared papers)Richard C. Jaeger (20 shared papers)Michael C. Hamilton (25 shared papers)Christopher J. Silva (4 shared papers)Pradeep Lall (14 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (17 papers)Journal of the American Helicopter Society (16 papers)IEEE Transactions on Electronics Packaging Manufacturing (16 papers)Journal of Aircraft (7 papers)Journal of Electronic Packaging (5 papers)
- Partner nations
- United StatesFranceAustralia
In The Last Decade
Wayne R. Johnson
323 papers receiving 7.3k citations
Wayne R. Johnson's Hit Papers
Peers
Comparison fields: 5 of 101
- Electrical and Electronic Engineering 3.9k
- Aerospace Engineering 1.6k
- Computational Mechanics 718
- Ceramics and Composites 158
- Global and Planetary Change 522
Countries citing papers authored by Wayne R. Johnson
This map shows the geographic impact of Wayne R. Johnson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wayne R. Johnson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wayne R. Johnson more than expected).
Fields of papers citing papers by Wayne R. Johnson
This network shows the impact of papers produced by Wayne R. Johnson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wayne R. Johnson. The network helps show where Wayne R. Johnson may publish in the future.
Co-authors
The 25 scholars most cited alongside Wayne R. Johnson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 348 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review Hit paper breakdown → | 1996 | 1238 |
| 2 | The Changing Automotive Environment: High-Temperature Electronics Hit paper breakdown → | 2004 | 737 |
| 3 | 2018 | 270 | |
| 4 | 1991 | 167 | |
| 5 | 1975 | 161 | |
| 6 | 2016 | 129 | |
| 7 | CAMRAD - A COMPREHENSIVE ANALYTICAL MODEL OF ROTORCRAFT AERODYNAMICS AND DYNAMICS | 1994 | 120 |
| 8 | 2010 | 118 | |
| 9 | 2004 | 106 | |
| 10 | 2007 | 96 | |
| 11 | 1992 | 95 | |
| 12 | Concept Vehicles for VTOL Air Taxi Operations | 2018 | 89 |
| 13 | 2005 | 88 | |
| 14 | 2015 | 88 | |
| 15 | 2018 | 84 | |
| 16 | 2010 | 80 | |
| 17 | 1986 | 76 | |
| 18 | 1986 | 67 | |
| 19 | 1981 | 59 | |
| 20 | 2007 | 59 |
About Wayne R. Johnson
Wayne R. Johnson is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Computational Mechanics, Global and Planetary Change and Mechanical Engineering, having authored 348 papers that have together received 7.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (105 papers), Aeroelasticity and Vibration Control (66 papers), Aerospace and Aviation Technology (38 papers), Silicon Carbide Semiconductor Technologies (33 papers), Advanced Aircraft Design and Technologies (31 papers), Computational Fluid Dynamics and Aerodynamics (24 papers), 3D IC and TSV technologies (20 papers) and Fluid dynamics and aerodynamics studies (18 papers). The work is most often cited by research in Electrical and Electronic Engineering (3.9k citations), Aerospace Engineering (1.6k citations), Computational Mechanics (718 citations), Ceramics and Composites (158 citations) and Global and Planetary Change (522 citations). Wayne R. Johnson has collaborated with scholars based in United States, France and Australia. Frequent co-authors include Jeff B. Casady, John L. Evans, Jeffrey C. Suhling, J. R. Thompson, Richard C. Jaeger, Michael C. Hamilton, Christopher J. Silva, Pradeep Lall, Eduardo Solis and W. Watt. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of the American Helicopter Society, IEEE Transactions on Electronics Packaging Manufacturing, Journal of Aircraft and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.