David Kopp
Impact in
- Condensed Matter Physics top 5%
- GaN-based semiconductor devices and materials
-
- Ga2O3 and related materials
Papers in
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- 3D IC and TSV technologies 6
- Electronic Packaging and Soldering Technologies 4
- Microwave Engineering and Waveguides 3
- Electromagnetic Compatibility and Noise Suppression 3
- Semiconductor Lasers and Optical Devices 2
-
- Ga2O3 and related materials 2
- Co-authors
- Patrick Fay (9 shared papers)Dong Seup Lee (3 shared papers)Xiang Gao (2 shared papers)Tomás Palacios (1 shared paper)Shiping Guo (1 shared paper)Gary H. Bernstein (6 shared papers)Seth T. Taylor (2 shared papers)Charles R. Sullivan (2 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Electron Device Letters (1 paper)IEEE Transactions on Advanced Packaging (1 paper)IEEE Transactions on Magnetics (1 paper)IEEE Microwave and Wireless Components Letters (1 paper)
- Partner nations
- United States
In The Last Decade
David Kopp
11 papers receiving 338 citations
Peers
Comparison fields: 5 of 22
- Condensed Matter Physics 251
- Electronic, Optical and Magnetic Materials 146
- Electrical and Electronic Engineering 250
- Atomic and Molecular Physics, and Optics 81
- Mechanics of Materials 28
Countries citing papers authored by David Kopp
This map shows the geographic impact of David Kopp's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Kopp with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Kopp more than expected).
Fields of papers citing papers by David Kopp
This network shows the impact of papers produced by David Kopp. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Kopp. The network helps show where David Kopp may publish in the future.
Co-authors
The 25 scholars most cited alongside David Kopp, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 220 | |
| 2 | 2007 | 29 | |
| 3 | 2007 | 25 | |
| 4 | 2013 | 19 | |
| 5 | 2011 | 18 | |
| 6 | 2013 | 10 | |
| 7 | 2006 | 7 | |
| 8 | 2014 | 6 | |
| 9 | 2014 | 3 | |
| 10 | 2014 | 3 | |
| 11 | 2013 | 2 | |
| 12 | 2022 | 0 |
About David Kopp
David Kopp is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Condensed Matter Physics, Atomic and Molecular Physics, and Optics and Materials Chemistry, having authored 12 papers that have together received 342 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (4 papers), GaN-based semiconductor devices and materials (3 papers), Microwave Engineering and Waveguides (3 papers), Electromagnetic Compatibility and Noise Suppression (3 papers), Ga2O3 and related materials (2 papers), Semiconductor Lasers and Optical Devices (2 papers) and Magnetic properties of thin films (2 papers). The work is most often cited by research in Condensed Matter Physics (251 citations), Electronic, Optical and Magnetic Materials (146 citations), Electrical and Electronic Engineering (250 citations), Atomic and Molecular Physics, and Optics (81 citations) and Mechanics of Materials (28 citations). David Kopp has collaborated with scholars based in United States. Frequent co-authors include Patrick Fay, Dong Seup Lee, Xiang Gao, Tomás Palacios, Shiping Guo, Gary H. Bernstein, Seth T. Taylor, Charles R. Sullivan, Frank B. Johnson and Weidong Li. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Electron Device Letters, IEEE Transactions on Advanced Packaging, IEEE Transactions on Magnetics and IEEE Microwave and Wireless Components Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.