Gerald Pasdast
Impact in
- Hardware and Architecture top 10%
- Parallel Computing and Optimization Techniques
- Embedded Systems Design Techniques
- VLSI and Analog Circuit Testing
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Semiconductor materials and devices
Papers in
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- 3D IC and TSV technologies 4
- Low-power high-performance VLSI design 2
- Electronic Packaging and Soldering Technologies 2
- VLSI and FPGA Design Techniques 1
- Advancements in Semiconductor Devices and Circuit Design 1
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- Interconnection Networks and Systems 2
- Co-authors
- Debendra Das Sharma (2 shared papers)Kemal Aygün (2 shared papers)Zhiguo Qian (1 shared paper)Shawna M. Liff (1 shared paper)Johanna Swan (2 shared papers)Adel Elsherbini (2 shared papers)Kimin Jun (2 shared papers)Roopali Sharma (1 shared paper)
- Journals
- Nature Electronics (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)2022 IEEE International Solid- State Circuits Conference (ISSCC) (1 paper)
- Partner nations
- United StatesIndiaIsrael
In The Last Decade
Gerald Pasdast
5 papers receiving 248 citations
Peers
Comparison fields: 5 of 35
- Hardware and Architecture 78
- Electrical and Electronic Engineering 185
- Computer Networks and Communications 65
- Computational Mathematics 1
- Automotive Engineering 11
Countries citing papers authored by Gerald Pasdast
This map shows the geographic impact of Gerald Pasdast's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gerald Pasdast with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gerald Pasdast more than expected).
Fields of papers citing papers by Gerald Pasdast
This network shows the impact of papers produced by Gerald Pasdast. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gerald Pasdast. The network helps show where Gerald Pasdast may publish in the future.
Co-authors
The 16 scholars most cited alongside Gerald Pasdast, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 105 | |
| 2 | 2022 | 61 | |
| 3 | 2021 | 52 | |
| 4 | 2024 | 31 | |
| 5 | 2024 | 8 |
About Gerald Pasdast
Gerald Pasdast is a scholar working on Electrical and Electronic Engineering, Computer Networks and Communications, Hardware and Architecture, Electronic, Optical and Magnetic Materials and Infectious Diseases, having authored 5 papers that have together received 257 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (4 papers), Low-power high-performance VLSI design (2 papers), Electronic Packaging and Soldering Technologies (2 papers), Interconnection Networks and Systems (2 papers), VLSI and FPGA Design Techniques (1 paper), VLSI and Analog Circuit Testing (1 paper), Copper Interconnects and Reliability (1 paper) and Advancements in Semiconductor Devices and Circuit Design (1 paper). The work is most often cited by research in Hardware and Architecture (78 citations), Electrical and Electronic Engineering (185 citations), Computer Networks and Communications (65 citations), Computational Mathematics (1 citation) and Automotive Engineering (11 citations). Gerald Pasdast has collaborated with scholars based in United States, India and Israel. Frequent co-authors include Debendra Das Sharma, Kemal Aygün, Zhiguo Qian, Shawna M. Liff, Johanna Swan, Adel Elsherbini, Kimin Jun, Roopali Sharma, Alexandra Kern and M. Mazharul Haq. Their work appears in journals such as Nature Electronics, IEEE Transactions on Components Packaging and Manufacturing Technology and 2022 IEEE International Solid- State Circuits Conference (ISSCC).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.